journal article·2025-07-01Open access

Effect of Ce/(Hf + Ce) ratio on ferroelectric and piezoelectric properties and effect of film thickness on ferroelectricity for thick CeO2–HfO2 films deposited by sputtering method without substrate heating

Yu-Ta Chen, Kazuki Okamoto, Nana Sun, Yuxian Hu, Nachi Chaya, Kohei Shimonosono, Miki Nakahata, Hiroyuki Ono, Wakiko Yamaoka, Yukari Inoue, Hiroshi Funakubo

Abstract

The dependence of ferroelectric properties on composition and film thickness was investigated for CeO 2 -HfO 2 films with various ratios x=Ce/(Hf+Ce), deposited on polyethylene terephthalate coated with an amorphous indium tin oxide layer (amorphous ITO/PET) substrates without substrate heating.Additionally, the dependence of composition on piezoelectric properties was examined.X-ray diffraction (XRD) analysis showed that the films consisted of atetragonal phase (T.) and/or orthorhombic (O.) phases with (111) and {100} out-of-plane orientations for the films with thicknesses ranging from 440 to 910 nm at x=0.23.In addition, the remnant polarization (P r ) increased from 6.0 to 11.7 C/cm 2 with the increase in the film thickness.To investigate the composition dependence, CeO 2 -HfO 2 films with a thickness of 800-1000 nm and x values of 0.17, 0.18, 0.23, and 0.28 were prepared.XRD showed (111) and {100} orientations in all films.Clear P-E hysteresis loops and switching currents were observed for x=0.18 and 0.23, with P r exceeding 10.0 C/cm 2 , even in films deposited on amorphous ITO/PET without substrate heating.Moreover, these films exhibited piezoelectric properties consistent with P-E loops, showing their potential for flexible piezoelectric applications.
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Research context

OpenAlex topics: Ferroelectric and Negative Capacitance Devices · Ferroelectric and Piezoelectric Materials · Semiconductor materials and devices

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

School of Materials and Chemical Technology, Department of Materials Science and Engineering, Institute of Science Tokyo

Technology and Intellectual Property HQ, TDK Corporation

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