Participation of copper ions in formation of alginate conditioning layer: Evolved structure and regulated microbial adhesion

Antifouling function of copper-based layers is usually gained through the release of cuprous or copper ions to damage most fouling species. In this research the intervening mechanisms of copper ions in formation of simplified conditioning layer comprising marine polysaccharide alginate and subsequent adhesion of typical marine bacteria and algae were studied. Fast interaction of Cu²⁺ with alginate with the formation of copper alginate multimers was observed for the first time by negative-staining electron microscopy. Interconnecting chains of alginate and copper alginate upon adsorption on silicon wafer and tangled structure of the conditioning layer were further characterized by atomic force microscopy. Adhesion testing showed that consumption of copper ions by their linking with alginate in incubation solutions resulted in mitigated toxicity of the ions to the microorganisms Bacillus sp., Chlorella pyrenoidosa and Phaeodactylum tricornutum. The results would give insight into understanding and regulating the formation of conditioning layer for desired antifouling performances.