The removal of 10-nm contaminant particles from micron-scale trenches using CO2 nano bullets
Source abstract
Abstract
The removal of nano-sized contaminant particles (CPs) from trenches formed on Si wafer is an important issue in the semiconductor industry. The particle beam technique, which is an advanced aerosol cleaning technique using nano-sized bullet particles (BPs) shot at supersonic velocity, has successfully cleaned CPs on flat surfaces down to 10 nm. In this paper, the same technique was applied to the removal of 10 nm Al2O3 particles from micron-scale trenches using CO2 nano bullets. Trenches of 4, 10, and 20 μm depth were fabricated at 2 μm and 50 μm widths, with a maximum aspect ratio of 10. When nano-sized bullets were shot into the contaminated trenches, 10 nm contaminants deposited on the side walls, bottom surfaces, and corners were completely removed from a variety of trenches in just a few seconds. Cleaning efficiency greater than 95 % was attained. Size and velocity of the BPs were the important parameters affecting removal of CPs in the 10 nm size range from micron-scale trenches.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Particle Dynamics in Fluid Flows · Aerosol Filtration and Electrostatic Precipitation · nanoparticles nucleation surface interactions
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (19)
Show source-provided references
1. Anderson JD (1990) Modern compressible flow with historical perspective, 2nd edn. McGraw-Hill, New York
2. Bae H, Kim IH, Kim EJ, Lee JW (2010) Generation of nano-sized Ar-N-2 compound particles by homogeneous nucleation and heterogeneous growth in a supersonic expansion. J Aerosol Sci 41:243–256. doi: 10.1016/j.jaerosci.2009.11.00510.1016/j.jaerosci.2009.11.005 ↗
3. Bakharari K, Guldiken R, Makaram P et al (2006) Experimental and numerical investigation of nanoparticle removal using acoustic streaming and the effect of time. J Electrochem Soc 153:G846–G850. doi: 10.1149/1.221728710.1149/1.2217287 ↗
4. Hwang KS, Lee MJ, Yi MY, Lee JW (2009) Removing 20 nm ceramic particles using a supersonic particle beam from a contoured Laval nozzle. J Thin Solid Films 517:3866–3869. doi: 10.1016/j.tsf.2009.01.13210.1016/j.tsf.2009.01.132 ↗
5. Hwang K, Lee K, Kim I, Lee JW (2011) Removing 10-nm contaminant particles from Si wafer using argon bullet particles. J Nanoparticle Res 13:4979–4986. doi: 10.1007/s11051-011-0479-810.1007/s11051-011-0479-8 ↗
6. International Technology Roadmap for Semiconductors (2011a) Yield enhancement report and table, available from http://public.itrs.net
7. International Technology Roadmap for Semiconductors (2011b) Interconnect report and table, available from http://public.itrs.net
8. Kim I, Hwang K, Lee JW (2012a) Removing 20 nm PSL particles using a supersonic nano-particle beam. J Adhesion Sci Technol 26:1419–1427. doi: 10.1163/156856111x61829010.1163/156856111X618290 ↗
9. Kim I, Hwang K, Lee JW (2012b) Removal of 10-nm contaminant particles from Si wafers using CO2 bullet particles. J Nanoscale Res Lett 7:211–218. doi: 10.1186/1556-276x-7-21110.1186/1556-276X-7-211 ↗
10. Koyanagi M, Nakamura T, Yamada Y et al (2006) Three-dimensional integration technology based on wafer bonding with vertical buried interconnections. J Electron Devices 53:2799–2808. doi: 10.1109/ted.2006.88407910.1109/TED.2006.884079 ↗
11. Lauerhaas J, Weyhand J, Thomes G (2005) Advanced cryogenic aerosol cleaning: application to damage-free cleaning of sensitive structured wafers. IEEE/SEMI advanced semiconductor manufacturing conference. Conference FSI Doc. No. 1245-RPS-0405-ENG
12. Lee JW, Hwang KS, Lee KH et al (2009) Removing 20 nm particles using a supersonic argon particle beam generated with a contoured laval nozzle. J Adhesion Sci Technol 23:769–777. doi: 10.1163/156856108x39626410.1163/156856108X396264 ↗
13. Lim H, Jang D, Kim D, Lee JW, Lee JM (2005) Correlation between particle removal and shock-wave dynamics in the laser shock cleaning process. J Appl Phys 97:054903. doi: 10.1063/1.185705610.1063/1.1857056 ↗
14. Lin H, Chioujones K, Lauerhaas J, Freebern T, Yu CF (2007) Damage-free cryogenic aerosol clean processes. J IEEE Trans Semicond Manuf 20:101–106. doi: 10.1109/tsm.2007.89664310.1109/TSM.2007.896643 ↗
15. McDermott W, Sferlazzo P (1999) Argon aerosol surface cleaning: an overview. In: Mittal K (ed) Particles on surface 5&6: detection, adhesion and removal. Utrecht, The Netherlands, pp 239–249
16. Rimai DS, Quesnel DJ (2001) Fundamentals of particle adhesion. Adhesion Society, Global Press, Moorhead
17. Sakakibara J, Noda Y, Shibata T et al (2008) 600 V-class super junction MOSFET with high aspect ratio P/N columns structure. 20th international symposium on power semiconductor devices and IC’s, pp 299–30210.1109/ISPSD.2008.4538958 ↗
18. Sherman R (1999) Carbon dioxide snow cleaning. J Part Sci Technol 25:37–57. doi: 10.1080/0272635060114642410.1080/02726350601146424 ↗
19. Wagener TJ, Kawaguchi K (2004) Improved yields for the nano-technology era using cryogenic aerosols. IEEE/SEMI advanced semiconductor manufacturing conference and workshop, vol 05, pp 467–471