Optimizing the PECVD Process for Stress-Controlled Silicon Nitride Films: Enhancement of Tensile Stress via UV Curing and Layered Deposition

Silicon nitride (SiN) films deposited via plasma-enhanced chemical vapor deposition (PECVD) exhibit tunable tensile stress, which is critical for various microelectronic and optoelectronic applications. In this paper, the effects of silane (SiH4) flow rate during PECVD deposition, ultraviolet (UV) curing, and layered deposition on the tensile stress of SiN films are mainly investigated. The results reveal that increasing the SiH4 concentration raises hydrogen incorporation, which modifies internal stress dynamics. UV curing significantly increases tensile stress by breaking N-H and Si-H bonds, facilitating hydrogen desorption, and promoting Si-N-Si crosslinking. The optimal UV curing duration stabilizes tensile stress at approximately 1570 MPa, while excessive UV power alters hydrogen content dynamics, reducing stress. Additionally, layered deposition further amplifies stress enhancement, with films subjected to multiple deposition cycles exhibiting increased densification and crosslinking. The combined optimization of PECVD deposition parameters, UV curing, and layered deposition provides a robust strategy for tailoring SiN film stress, offering a versatile approach to engineering mechanical properties for advanced applications.