A Versatile Top-Down Patterning Technique for Perovskite On-Chip Integration

Federico Fabrizi; Saeed Goudarzi; Sana Khan; Tauheed Mohammad; Liudmila Starodubtceva; Piotr J. Cegielski; Felix Thiel; Sercan Özen; Maximilian Schiffer; Felix Lang; Peter Haring Bolívar; Thomas Riedl; Gerhard Müller-Newen; Surendra B. Anantharaman; Maryam Mohammadi; Max C. Lemme

doi:10.1021/acsnano.5c10397

journal article·2025-08-26Open access

A Versatile Top-Down Patterning Technique for Perovskite On-Chip Integration

Federico Fabrizi, Saeed Goudarzi, Sana Khan, Tauheed Mohammad, Liudmila Starodubtceva, Piotr J. Cegielski, Felix Thiel, Sercan Özen, Maximilian Schiffer, Felix Lang, Peter Haring Bolívar, Thomas Riedl, Gerhard Müller-Newen, Surendra B. Anantharaman, Maryam Mohammadi, Max C. Lemme

ACS Nano· Volume 19· Issue 33

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Source abstract

Abstract

Metal-halide perovskites (MHPs) have exciting optoelectronic properties and are under investigation for various applications, such as photovoltaics, light-emitting diodes, and lasers. An essential step toward exploiting the full potential of this class of materials is their large-scale, on-chip integration with high-resolution, top-down patterning. The development of such patterning methods for perovskite films is challenging because of their intrinsic ionic nature and adverse reactions with the solvents used in standard lithography processes. Here, we introduce a versatile and precise method comprising photolithography and reactive ion etching (RIE) processes that can be tuned to accommodate different perovskite compositions and morphologies. Our method utilizes conventional photoresists at reduced temperatures to create micron-sized features down to 1 μm, providing high reproducibility from chip to chip. The patterning technique is validated through atomic force microscopy (AFM), X-ray diffraction (XRD), optical spectroscopy, and scanning electron microscopy (SEM). It enables the scalable and high-throughput on-chip monolithic integration of MHPs.

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Research context

Electronic materials

OpenAlex topics: Semiconductor materials and devices · Silicon and Solar Cell Technologies · Electronic Packaging and Soldering Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

AMO GmbH, Otto-Blumenthal-Straße 25, Aachen 52074, Germany

Chair of Electronic Devices, RWTH Aachen University, Otto-Blumenthal-Straße 25, Aachen 52074, Germany

Institute for High Frequency and Quantum Electronics

University of Siegen

Institute Freigeist Juniorgroup, Radiation Tolerant Electronics with Soft Semiconductors (ROSI), University of Potsdam, Karl-Liebknecht-Straße 24/25, Potsdam-Golm 14469, Germany

Institute of Electronic Devices, University of Wuppertal, Rainer-Gruenter-Str. 21, Wuppertal 42119, Germany

Wuppertal Center for Smart Materials & Systems (CM@S), University of Wuppertal, Rainer-Gruenter-Str. 21, Wuppertal 42119 Germany

Institute of Biochemistry and Molecular Biology, Uniklinik RWTH Aachen , Pauwelsstrasse 30, Aachen 52074 Germany

Low-dimensional Semiconductors Lab, Department of Metallurgical and Materials Engineering

Indian Institute of Technology Madras

Funding

Bundesministerium f?r Bildung und Forschung · Deutsche Forschungsgemeinschaft · H2020 Marie Sklodowska-Curie Actions · Horizon 2020 Framework Programme · Volkswagen Foundation

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