A mechanical assessment of flexible optoelectronic devices
Source abstract
Abstract
This work has demonstrated novel experimental methods and their relevant analysis to evaluate the fracture properties of thin brittle films on compliant substrates for flexible optoelectronic devices. Based on the understanding of the failure mechanisms, mechanical calculation has been provided to estimate the thin film fracture toughness and film delamination toughness. These values serve as design parameters on the device flexibility and reliability.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Advanced ceramic materials synthesis
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