journal article·2012-11-27Open access

Quantitative Thermal Imaging of Single-Walled Carbon Nanotube Devices by Scanning Joule Expansion Microscopy

Xu Xie, Kyle L. Grosse, Jizhou Song, Chaofeng Lu, Simon Dunham, Frank Du, Ahmad E. Islam, Yuhang Li, Yihui Zhang, Eric Pop, Yonggang Huang, William P. King, John A. Rogers

ACS Nano· Volume 6· Issue 11

Abstract

Electrical generation of heat in single-walled carbon nanotubes (SWNTs) and subsequent thermal transport into the surroundings can critically affect the design, operation, and reliability of electronic and optoelectronic devices based on these materials. Here we investigate such heat generation and transport characteristics in perfectly aligned, horizontal arrays of SWNTs integrated into transistor structures. We present quantitative assessments of local thermometry at individual SWNTs in these arrays, evaluated using scanning Joule expansion microscopy. Measurements at different applied voltages reveal electronic behaviors, including metallic and semiconducting responses, spatial variations in diameter or chirality, and localized defect sites. Analytical models, validated by measurements performed on different device structures at various conditions, enable accurate, quantitative extraction of temperature distributions at the level of individual SWNTs. Using current equipment, the spatial resolution and temperature precision are as good as ∼100 nm and ∼0.7 K, respectively.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Thermal properties of materials · Carbon Nanotubes in Composites · Thermal Radiation and Cooling Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Mechanical and Aerospace Engineering, University of Miami, Coral Gables, Florida 33146, United States

Department of Civil Engineering and Soft Matter Research Center, Zhejiang University, Hangzhou 310058, China

Department of Mechanical Engineering and Department of Civil and Environmental Engineering, Northwestern University, Evanston, Illinois 60208, United States

Center for Mechanics and Materials, Tsinghua University, Beijing 100084, People's Republic of China

Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory, University of Illinois at Urbana—Champaign, Urbana, Illinois 61801, United States

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