journal article·2018-05-22

Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process

Bong Hoon Kim, Jungyup Lee, Sang Min Won, Zhaoqian Xie, Jan-Kai Chang, Yongjoon Yu, Youn Kyoung Cho, Hokyung Jang, Ji Yoon Jeong, Yechan Lee, Arin Ryu, Do Hoon Kim, Kun Hyuck Lee, Jong Yoon Lee, Fei Liu, Xueju Wang, Qingze Huo, Seunghwan Min, Di Wu, Bowen Ji, Anthony Banks, Jeonghyun Kim, Nuri Oh, Hyeong Min Jin, Seungyong Han, Daeshik Kang, Chi Hwan Lee, Young Min Song, Yihui Zhang, Yonggang Huang, Kyung-In Jang, John A. Rogers

ACS Nano· Volume 12· Issue 5
Publisher page

Abstract

Recently developed approaches in deterministic assembly allow for controlled, geometric transformation of two-dimensional structures into complex, engineered three-dimensional layouts. Attractive features include applicability to wide ranging layout designs and dimensions along with the capacity to integrate planar thin film materials and device layouts. The work reported here establishes further capabilities for directly embedding high-performance electronic devices into the resultant 3D constructs based on silicon nanomembranes (Si NMs) as the active materials in custom devices or microscale components released from commercial wafer sources. Systematic experimental studies and theoretical analysis illustrate the key ideas through varied 3D architectures, from interconnected bridges and coils to extended chiral structures, each of which embed n-channel Si NM MOSFETs (nMOS), Si NM diodes, and p-channel silicon MOSFETs (pMOS). Examples in stretchable/deformable systems highlight additional features of these platforms. These strategies are immediately applicable to other wide-ranging classes of materials and device technologies that can be rendered in two-dimensional layouts, from systems for energy storage, to photovoltaics, optoelectronics, and others.
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Research context

OpenAlex topics: Advanced Materials and Mechanics · Advanced Sensor and Energy Harvesting Materials · Modular Robots and Swarm Intelligence

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Departments of Materials Science and Engineering, Biomedical Engineering, Chemistry, Neurological Surgery, Mechanical Engineering, Electrical Engineering and Computer Science, Simpson Querrey Institute & Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, Illinois 60208, United States

Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana−Champaign, Urbana, Illinois 61801, United States

Department of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, United States

AML, Department of Engineering Mechanics, Center for Mechanics and Materials, Tsinghua University, Beijing 100084, China

Center for Mechanics and Materials, Center for Flexible Electronics Technology, AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China

Department of Electronics Convergence Engineering, Kwangwoon University, Seoul 01897, Republic of Korea

Division of Materials Science and Engineering, Hanyang University, Seoul 04763, Republic of Korea

Institute for Molecular Engineering, The University of Chicago, Chicago, Illinois 60637, United States

Department of Mechanical Engineering, Ajou University, Suwon, 443-749, Republic of Korea

Weldon School of Biomedical Engineering, School of Mechanical Engineering, The Center for Implantable Devices, and Birck Nanotechnology Center, Purdue University, West Lafayette, Indiana 47907, United States

School of Electrical Engineering and Computer Science, Gwangju Institute of Science and Technology (GIST), Gwangju 61005, Republic of Korea

Department of Robotics Engineering, Daegu Gyeongbuk Institute of Science and Technology (DGIST), Daegu 42988, Republic of Korea

Funding

Division of Industrial Innovation and Partnerships · National Research Foundation of Korea · National Institute of Biomedical Imaging and Bioengineering · Division of Civil, Mechanical and Manufacturing Innovation · National Natural Science Foundation of China

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