Wafer‐Scale Atomic Assembly for 2D Multinary Transition Metal Dichalcogenides for Visible and NIR Photodetection

Abstract The tunable properties of 2D transition‐metal dichalcogenide (TMDs) materials are extensively investigated for high‐performance and wavelength‐tunable optoelectronic applications. However, the precise modification of large‐scale systems for practical optoelectronic applications remains a challenge. In this study, a wafer‐scale atomic assembly process to produce 2D multinary (binary, ternary, and quaternary) TMDs for broadband photodetection is demonstrated. The large‐area growth of homogeneous MoS₂, Ni_0.06Mo_0.26S_0.68, and Ni_0.1Mo_0.9S_1.79Se_0.21 is carried out using a succinct coating of the single‐source precursor and subsequent thermal decomposition combined with thermal evaporation of the chalcogen powder. The optoelectrical properties of the multinary TMDs are dependent on the combination of heteroatoms. The maximum photoresponsivity of the MoS₂‐, Ni_0.06Mo_0.26S_0.68‐, and Ni_0.1Mo_0.9S_1.79Se_0.21‐based photodetectors is 3.51 × 10⁻⁴, 1.48, and 0.9 A W⁻¹ for 532 nm and 0.063, 0.42, and 1.4 A W⁻¹ for 1064 nm, respectively. The devices exhibited excellent photoelectrical properties, which is highly beneficial for visible and near‐infrared (NIR) photodetection.