Direct Electron‐Beam Writing of Highly Conductive Wires in Functionalized Fullerene Films

Abstract This work demonstrates the patterning of thin films (≈25 nm) of a newly synthesized fullerene derivative by direct‐write electron‐beam lithography to produce highly conducting carbon microstructures. Scanning electron microscopy and atomic force microscopy are used to characterize the resulting microstructure morphology, whilst the resistivities of the structures are probed using four‐point probe electrodes deposited on the microstructures by lift‐off. The microstructures have a resistivity of ≈9.5 × 10⁻³ Ω cm after exposure to an electron dose of 0.1 C cm⁻². The method may have applications in the generation and electrical contacting of organic electronics, organic photovoltaics, and lab‐on‐a‐chip devices.