journal article·2025-06

Toward Understanding Temperature and Bias Instabilities of Anti‐ambipolar Transistors via Low‐Frequency Noise Spectroscopy

Jaechan Song, Youngmin Han, Ryun‐Han Koo, Junghye Seo, Hocheon Yoo, Wonjun Shin

Small· Volume 21· Issue 25
Publisher page

Abstract

Abstract Anti‐ambipolar transistors (AATs) featuring heterojunctions of n‐ and p‐type semiconductors have garnered significant research interest owing to their unique electrical characteristics. With the nonlinear current response, AATs hold great promise for a wide range of next‐generation electronic applications, further enhancing advanced logic and in‐memory computing functionality. However, the seamless integration of AATs into these applications hinges upon addressing their susceptibility to temperature and bias instabilities, a challenge that has yet to be systematically explored. Here, the origin of these instabilities is reported in AATs composed of indium‐gallium‐zinc oxide (IGZO) and dinaphtho[2,3‐b:2′,3′‐fjthieno[3,2‐b]thiophene (DNTT) through low‐frequency noise (LFN) spectroscopy. The findings reveal that the AATs exhibit a notable reduction in peak current with temperature instability and an abrupt decrease in drain current under applied DC bias. It is examined that these instabilities stem from defect‐related carrier transport mechanisms at the n/p heterojunction, evidenced by the observation of 1/ f 4 noise. Furthermore, a comprehensive comparative analysis is provided of 1/ f 4 noise behavior with and without the insertion of an insulative layer of AAT. This provides the microscopic origin of how the LFN generation mechanism changes the defect‐related carrier conduction at the interface and mitigates the bias and temperature instabilities.
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Research context

OpenAlex topics: Radio Frequency Integrated Circuit Design · Advancements in Semiconductor Devices and Circuit Design · Semiconductor materials and devices

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Semiconductor Engineering Gachon University 1342 Seongnam‐daero Seongnam 13120 South Korea

Department of Electrical and Computer Engineering Inter‐University Semiconductor Research Center Seoul National University Seoul 08826 South Korea

Yonsei Center for Research Facilities Yeonsei University 50 Yonsei‐ro Seoul 03722 South Korea

Department of Electronic Engineering Gachon University 1342 Seongnam‐daero Seongnam 13120 South Korea

Department of Semiconductor Convergence Engineering Sungkyunkwan University Suwon 16419 South Korea

Funding

National Research Foundation of Korea · Gachon University · Ministry of Science and ICT, South Korea

References (34)

Show source-provided references
1. 10.1038/s41928-019-0207-410.1038/s41928-019-0207-4 ↗
2. 10.1038/s41928-018-0086-010.1038/s41928-018-0086-0 ↗
3. 10.1038/s41928-021-00640-710.1038/s41928-021-00640-7 ↗
4. 10.1038/s41928-024-01142-y10.1038/s41928-024-01142-y ↗
5. 10.1038/nmat137710.1038/nmat1377 ↗
6. 10.1038/nmat302610.1038/nmat3026 ↗
7. 10.1038/ncomms1341310.1038/ncomms13413 ↗
8. 10.1038/s41563-022-01402-210.1038/s41563-022-01402-2 ↗
9. 10.1002/adma.20230629010.1002/adma.202306290 ↗
10. 10.1038/s41563-022-01450-810.1038/s41563-022-01450-8 ↗
11. 10.1002/adma.20240511510.1002/adma.202405115 ↗
12. 10.1021/acsnano.1c0076210.1021/acsnano.1c00762 ↗
13. 10.1002/aelm.20220070410.1002/aelm.202200704 ↗
14. 10.1021/acs.nanolett.4c0167910.1021/acs.nanolett.4c01679 ↗
15. 10.1038/s41467-024-50496-610.1038/s41467-024-50496-6 ↗
16. 10.1021/acsnano.1c0703210.1021/acsnano.1c07032 ↗
17. 10.1038/s41467-023-39394-510.1038/s41467-023-39394-5 ↗
18. 10.1002/adfm.20231621710.1002/adfm.202316217 ↗
19. 10.1109/TIA.2020.304512010.1109/TIA.2020.3045120 ↗
20. 10.1002/adma.20220108210.1002/adma.202201082 ↗
21. 10.1038/nnano.2013.14410.1038/nnano.2013.144 ↗
22. 10.1016/j.snb.2023.13355110.1016/j.snb.2023.133551 ↗
23. 10.1039/D1NR06525D10.1039/D1NR06525D ↗
24. 10.1063/5.019714210.1063/5.0197142 ↗
25. 10.1002/aelm.20220086010.1002/aelm.202200860 ↗
26. 10.1063/1.336113010.1063/1.3361130 ↗
27. 10.1109/LED.2011.214338610.1109/LED.2011.2143386 ↗
28. 10.1109/LED.2009.201721310.1109/LED.2009.2017213 ↗
29. 10.1109/TED.2013.229349710.1109/TED.2013.2293497 ↗
30. a)Z.Wang H.Wang Y.Wang Z.Sun L.Zeng R.Wang R.Huang In2024 IEEE Int. Reliability Physics Symp. (IRPS) IEEE New York2024 pp.6A‐3;10.1109/IRPS48228.2024.10529362 ↗
31. 10.1109/LED.2024.345277610.1109/LED.2024.3452776 ↗
32. 10.1016/j.progpolymsci.2013.08.00810.1016/j.progpolymsci.2013.08.008 ↗
33. 10.1063/1.239293710.1063/1.2392937 ↗
34. 10.1002/adma.20220127710.1002/adma.202201277 ↗