Temperature‐Robust Broadband Metamaterial Absorber via Semiconductor MOFs/Paraffin Hybridization

Abstract The demand for temperature‐robust electromagnetic wave (EMW) absorption materials is escalating due to the varying operational temperatures of electronic devices, which can easily soar up to 100 °C, significantly affecting EMW interference management. Traditional absorbers face performance degradation across broad temperature ranges due to alterations in electronic mobility and material impedance. This study presented a novel approach by integrating semiconductor metal–organic frameworks (SC‐MOFs) with paraffin wax (PW), leveraging the precise control of interlayer spacing in SC‐MOFs for electron mobility regulation and the introduction of paraffin wax for temperature‐inert electromagnetic properties. This synergistic strategy enhanced dielectric properties and impedance matching across temperature ranges from ambient to 100 °C. A metamaterial shell layer, designed through finite element simulation and fabricated by 3D printing, encapsulated the composite, resulting in a broadband metamaterial absorber with an 11.81 GHz effective absorption bandwidth and a nearly unchanged absorption peak position across 25–100 °C. This temperature‐robust metamaterial absorber paves the way for advanced EMW management materials capable of operating reliably in extreme temperature environments.