TEM observation of interfaces in a solder joint in a semiconductor device
Source abstract
Abstract
Microstructure of a joint between a Pb–Sn eutectic solder and an electroless Ni–8 mass% P has beenexamined using transmission electron microscopy. Four layers, i.e. Ni3Sn4, Ni48Sn52, Ni2SnP and Ni–20 mass% P, are formed between the solder and the electroless Ni–8 mass% P. Among them, Ni48Sn52 and Ni2SnP were found for the first time in a solder joint. Spherical voids are formed at the interface between Ni48Sn52 and Ni2SnP, and columnar voids are formed at the interface between Ni2SnP and Ni–20 maas% P. From the analysis of the migration of the respective interfaces observed during in situ heatingexperiments, it is concluded that these voids are Kirkendall voids formed due to the difference in diffusivity of Ni across the interfaces. Fracture takes place at either of those interfaces during a dropping test.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Metallurgical and Alloy Processes · Semiconductor materials and interfaces
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
>LSI Assembly Development Division, Fujitsu Limited, Tado, Mie, 511-0192, Japan
>Department of Quantum Engineering,Faculty of Engineering, Nagoya University, Furo-cho, Nagoya Aichi, 464-8603, Japan
References (19)
Show source-provided references
1. R.R. Tummala · Microelectronic Packaging Handbook · 1989
2. T.Y. Pan · 1997 · 2 · 1347
3. 10.1016/0040-6090(94)90761-710.1016/0040-6090(94)90761-7 ↗
4. 10.1016/0254-0584(94)90142-210.1016/0254-0584(94)90142-2 ↗
5. Z. Mei · 1997 · 2 · 1543
6. 10.1063/1.37062710.1063/1.370627 ↗
7. 10.1080/09500830017614610.1080/095008300176146 ↗
8. 10.1016/0022-5088(73)90037-410.1016/0022-5088(73)90037-4 ↗
9. T.B. Masasalski · Binary Phase Diagrams · 1986
10. K.T. Zieheke · Met. Prog. · 1960 · 77 · 83
11. A. Brenner · 1959 · 3
12. 10.1149/1.242527510.1149/1.2425275 ↗
13. 10.1149/1.242355710.1149/1.2423557 ↗
14. 10.1109/33.6257410.1109/33.62574 ↗
15. C.W. Allen · 1985 · 139
16. 10.1016/S1359-6454(98)00192-X10.1016/S1359-6454(98)00192-X ↗
17. 10.1016/0036-9748(80)90338-510.1016/0036-9748(80)90338-5 ↗
18. 10.1007/BF0113240510.1007/BF01132405 ↗
19. J.H. Lau · Solder Joint Reliability of BGA, CSP, Flip Chip and Fine Pitch SMT Assembles · 1996 · 78