Testing Semiconductor Products Using Low-Frequency Noise Parameters
Source abstract
Abstract
Abstract This article continues and supplements the article with the same title published in Russian Journal of Nondestructive Testing, no. 1, 2022, which provides six ways to assess the quality and reliability of semiconductor products (SCPs) using low-frequency (LF) noise parameters. This paper presents a generalization of the results previously obtained by the authors and describes four more methods for diagnosing and evaluating the reliability of SCPs by varying the parameters of low- frequency noise under additional external influences such as electrostatic discharge and (or) thermal annealing. It is shown that additional impacts make it possible to increase the reliability of the assessment of the SCP reliability.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Integrated Circuits and Semiconductor Failure Analysis · Silicon Carbide Semiconductor Technologies · Electrostatic Discharge in Electronics
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (16)
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