journal article·2024-04-12

Robust Perovskite X-ray Flat Panel Detector by Anisotropic Conductive Adhesive to Regulate Thermal Stress

Zhiqiang Liu, Haodi Wu, Haoming Yang, Zihao Song, Xinyuan Du, Xin He, Wuchen Xiang, Yuanpeng Shi, Jincong Pang, Ling Xu, Zhiping Zheng, Yao Zhang, Jiang Tang, Guangda Niu

ACS Energy Letters· Volume 9· Issue 4
Publisher page

Abstract

Polycrystalline perovskite films offer promise for next-generation X-ray flat-panel detectors due to their ease of large-area fabrication. However, the perovskite–thin-film transistor (TFT) manufacturing mismatch causes defects (e.g., pores, fracture, and delamination), impacting device yield and dead pixel rates. We identify that thermal stress between the perovskite film and TFT array plays a pivotal role in causing these defects. We first propose the strategy of adding an anisotropic conductive adhesive as a stress buffer layer at the original interface. The Tresca stress at the interface was reduced from 113 to 58 MPa. The film fracture, pinhole, and delamination have been suppressed, and the device could even sustain a long-term vibration fatigue test. The assembled FPD exhibits 0.52 lp/pix spatial resolution and a 0.63% dead pixel rate, which outperform previous studies. This approach provides new insights and avenues for the fabrication of integrated perovskite–TFT devices with enhanced interface connectivity.
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Research context

OpenAlex topics: Perovskite Materials and Applications · Advanced Semiconductor Detectors and Materials · Chalcogenide Semiconductor Thin Films

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Wuhan National Laboratory for Optoelectronics and School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan 430074, Hubei Province, People’s Republic of China

Ezhou Institute of Industrial Technology, Huazhong University of Science and Technology, Ezhou 436044, Hubei Province, People’s Republic of China

Research Center for Medical Artificial Intelligence, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, Guangdong 518055, People’s Republic of China

Department of Engineering Mechanics, School of Aerospace Engineering, Huazhong University of Science and Technology, Wuhan 430074, Hubei Province, People’s Republic of China

School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan 430074, Hubei Province, People’s Republic of China

Funding

Shenzhen Fundamental Research Program · China Postdoctoral Science Foundation · Huazhong University of Science and Technology · Natural Science Foundation of Hubei Province · Major State Basic Research Development Program of China · National Natural Science Foundation of China · Wuhan National Laboratory for Optoelectronics

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