Tough Polyimide Nanocomposites With High Thermal Resistance at Extremely Low Filler Content

ABSTRACT In this study, we developed strong, tough, and thermally resistant polyimide (PI) nanocomposites with an extremely low content of graphene oxide (GO) using a novel in situ synthesis approach. The high dispersibility of GO in PI, achieved through in situ polymerization, led to significant enhancements in mechanical properties and thermal resistance. Notably, Young's modulus increased by 37% at a GO content of 0.01 wt%, while maintaining high toughness. Additionally, the thermal decomposition temperature at 5% weight loss and the glass transition temperature of the nanocomposites with 0.01 wt% GO were elevated by 15°C and 16°C, respectively, compared to pure PI. To the best of our knowledge, this is the first approach to develop graphene‐based PI nanocomposites with such a low filler content while achieving excellent physical properties.