journal article·1983-07

Lower‐curing‐Temperature PMR polyimides

Peter Delvigs

Polymer Composites· Volume 4· Issue 3
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Abstract

Abstract Studies were performed to achieve lower‐curing temperature PMR (polymerization of monomer reactants) polyimides. Partial substitution of a p‐aminostyrene end‐cap for the monomethyl ester of 5‐norbornene‐2,3‐dicarboxylic acid lowered the final cure temperature of typical PMR resins from 600 to 500°F. The weight‐loss characteristics of neat resins and graphite fiber composites prepared by using the mixed end‐cap approach were determined at 600°F. The room temperature and short‐term elevated temperature mechanical properties of the composites at 550°F and 600°F were determined. The mechanical‐property‐retention characteristics of the composites at 550°F and 600°F are also discussed.
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Research context

OpenAlex topics: Synthesis and properties of polymers · Epoxy Resin Curing Processes · Silicone and Siloxane Chemistry

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References (5)

Show source-provided references
1. 10.1002/app.1972.07016040910.1002/app.1972.070160409 ↗
2. T. T.Serafini P.Delvigs andG.Lightsey U.S. Pat. 3 745 149 (Julyy 10 1973).
3. T. T.Serafini P.Delvigs andR. D.Vannucci NASA TM 81705 (1981).
4. R. D.Vannucci NASA TM 81557 (1980).
5. 10.1002/pol.1979.17017082510.1002/pol.1979.170170825 ↗