13 C CP/MAS NMR studies on the curing characteristics of phenol formaldehyde resin in the presence of nano cupric oxide and surfactants. II. Effect of CuO loading levels
Source abstract
Abstract
The effect of various loadings of nano cupric oxide (CuO) and surfactants in the formulation of phenol formaldehyde (PF) adhesive was investigated using solid 13 C CP/MAS NMR. Bonding strength and water resistance of plywood made with the modified adhesive were conducted. Solid NMR analysis showed that the addition of nano CuO alone or in combination with surfactant together was effective in improving the curing property of PF resin, which was confirmed by the NMR reveal that the amount of aliphatic carbons from methylene linkages increase with the addition of nano CuO in the PF resin. The addition of the mixture of alkane surfactant and nano CuO in the resin improved the water resistance property of the resulted plywood as well. POLYM. COMPOS., 37:949–954, 2016. © 2014 Society of Plastics Engineers
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Research context
OpenAlex topics: Epoxy Resin Curing Processes · Lignin and Wood Chemistry · Polymer composites and self-healing
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
College of Material Engineering Southwest Forestry University Kunming Yunnan Province 650224 People's Republic of China
Yunnan Key Laboratory of Wood Adhesives and Glue Products Kunming Yunnan Province 650224 People's Republic of China
School of Packaging Michigan State University East Lansing Michigan 48824
Funding
National Natural Science Foundation of China · Key Project of Chinese Ministry of Education · China Scholarship Council
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