Tin‐Lead flake poly (ether sulfone) composite formed by in‐situ melt processing of tin‐lead particles

Abstract Tin‐lead (60Sn‐40Pb) flake poly(ether sulfone) (PES) composites in which the flakes were partially interconnected and of average thickness 2 μm were prepared by hot pressing molten Sn‐Pb particles in a matrix of PES at a temperature above the melting temperature of Sn‐Pb and above the glass transition temperature of PES. Hot pressing at 240°C and 6.51 Mpa resulted in a 15 vol% Sn‐Pb composite of lower electrical resistivity and higher electromagnetic interference shielding effectiveness than a PES composite containing 15 vol% aluminum flakes that were not formed in‐situ. The electrical properties of the in‐situ PES/Sn‐Pb flake composites were much better than those of PES/Sn‐Pb flake composites were fabricated by hot pressing at 310°C (the manufacturer‐suggested fabrication temperature), though the mechanical properties were not as good.