Thermal and mechanical properties of dough modeling compound reinforced ethylene propylene diene monomer/silicon rubber composites

Abstract Ethylene propylene diene monomer (EPDM)/silicon rubber composite was prepared by adding dough‐modeling compound (DMC). EPDM/silicon rubber is the matrix of the composite, and DMC is a disperse phase (reinforced phase). The morphology of the composite was studied by scanning electron microscopy, and it was found that the compatibility of DMC/EPDM/silicon rubber composite was good. The influence of the DMC and peroxide curing agents on the mechanical and thermal properties were studied. The results showed that the mechanical and thermal properties of the composite were best, when DMC/EPDM/silicon rubber was 80/25/75. The thermal properties of the composite prepared with added equivalent dicumyl peroxide was better than those with added benzoperoxide, but Shore A hardness and elongation at break are unchangeable. The integral properties of DMC reinforced EPDM/silicon rubber composite was much better than three raw materials. POLYM. COMPOS. 27:621–626, 2006. © 2006 Society of Plastics Engineers