Effect of advancement on epoxy prepreg processing—a dielectric analysis

Abstract With the relatively recent trend toward adaptive process control during processing of structural composites, there is need for an understanding of the nature of variations during cure that are encountered. Part‐to‐part variations can arise because of differences in thermal exposure arising from part placement or part thickness, or from chemical differences due to formulation or advancement. Microdielectric sensors are particularly well suited for monitoring thermoset cures from initial point of flow, through the liquid region, and on into the solid state. In this study, microdielectric sensors are used to systematically study the influence of resin advancement on cure behavior. Relationships between advancement and critical cure phenomena such as flow temperature, point of viscosity minimum, and reaction end point are discussed.