Preparation of β‐SiCw/BDM/DBA composites with excellent comprehensive properties

Functionalized β‐SiC whiskers (β‐SiCw) are employed to prepare β‐SiCw/ N , N ′‐4, 4′‐bimaleimide diphenyl methane/diallylbisphenol A (β‐SiCw/BDM/DBA) composites via powder blending‐casting method. The thermal conductive coefficient of the β‐SiCw/BDM/DBA composites is 0.994 W/mK with 40 wt% functionalized β‐SiCw, five times higher than that of pure BDM/DBA. The mechanical properties of the β‐SiCw/BDM/DBA composites are optimal with 10 wt% functionalized β‐SiCw. Both thermal resistance and dielectric constant are increased with the increasing addition of β‐SiCw. For a given β‐SiCw loading, the surface functionalization of β‐SiCw exhibits a positive effect on the thermal conductivities and mechanical properties of the β‐SiCw/BDM/DBA composites. POLYM. COMPOS., 35:1875–1878, 2014. © 2014 Society of Plastics Engineers