Octa(aminophenyl) polyhedral oligomeric silsesquioxane/boron‐containing phenol–formaldehyde resin nanocomposites: Synthesis, cured, and thermal properties

Abstract Octa(aminophenyl) polyhedral oligomeric silsesquioxane (OAP‐POSS) and boron‐containing phenol‐formaldehyde resin (BPFR) were synthesized, respectively. The BPFR nanocomposites with different OAP‐POSS content (wt%) were prepared, and their properties were characterized. The results show that the thermal degradation process of this nanocomposites can be divided into three stages, and they are all following the first order mechanism. The residual ratio and thermal degradation activation energy E_a of 9 wt% OAP‐POSS/BPFR nanocomposites are both better than others and the E_a increase gradually in three stages, which is 93.3, 134.0, and 181.9 kJ mol⁻¹, respectively. Its residual ratio at 900°C is 36.48%. The mechanical loss peak temperature T_p is 228°C for 12 wt% OAP‐POSSS/BPFR nanocomposites, which is higher 48°C than pure BPFR. POLYM. COMPOS., 2011. © 2011 Society of Plastics Engineers