Monitoring cure of autoclave‐molded parts by dielectric analysis

Abstract A study was undertaken to determine the feasibility of using dielectric analysis as a means of monitoring and controlling cure of large closures during autoclave molding. In dielectric analysis, the dissipation factor (DF) and capacitance (C) of the sample are continuously monitored as a function of time, temperature, and frequency. Dissipation factor profiles were established for the suppliers' recommended cure cycle and for modified cure cycles, Good reproducibility was obtained in dissipation factor profiles on subsequent scaling up to production size (7 ft · 20 ft) autoclaves. Good correlation was also observed during production runs of fullscale closures. The effects of cure variables on the dissipation factor profiles and on the mechanical properties of the prepared laminates were analyzed for extent of correlation. Results of this study show: (1) dielectric analysis can be used to monitor autoclave cure of composites, and (2) within limits, process control may be feasible.