Toughening of PA6 nanocomposites by reactive acrylonitrile–butadiene–styrene core–shell rubber particles
Source abstract
Abstract
The effect of addition of organoclay and the reactive ABS‐g‐MA core‐shell particles on the mechanical properties and morphology of blends of polyamide (PA6) were reported. The reactive rubber particles with core‐shell structure were selected as modifier instead of conventional reactive bulk rubber. The microstructure of the ternary nanocomposites was characterized by X‐ray diffraction (XRD), transmission electron microscopy (TEM), and scanning electron microscopy (SEM). Impact strength and stress–strain behavior of blends were measured as a function of organoclay content and core/shell ratio of ABS‐g‐MA. The organoclay plates affected the interfacial adhesion between polyamide and the core‐shell particles because of a shielding effect of organclay on the interacting of amine end groups of PA6 with the MA groups of ABS‐g‐MA. The poor dispersion behavior of ternary nanocomposites was observed when the core/shell ratio is 80/20, and with an increase of organoclay content, the core/shell dispersed phase size increased. Blends based on the maleated elastomer with the core/shell ratio 60/40 gave a more beneficial balance of toughness versus stiffness. POLYM. COMPOS., 35:864–871, 2014. © 2013 Society of Plastics Engineers
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Research context
OpenAlex topics: Polymer Nanocomposites and Properties · Polymer crystallization and properties · Tribology and Wear Analysis
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Engineering Research Center of Synthetic Resin and Special Fiber Ministry of Education Changchun University of Technology Changchun 130012 China
College of Materials Science and Engineering Changchun University of Technology Changchun 130012 China
Funding
Natural Science Foundation of China
References (37)
Show source-provided references
1. 10.1016/j.matdes.2010.05.02410.1016/j.matdes.2010.05.024 ↗
2. 10.1016/j.msea.2009.10.02210.1016/j.msea.2009.10.022 ↗
3. 10.1016/j.msea.2010.12.06710.1016/j.msea.2010.12.067 ↗
4. 10.1021/cm035137d10.1021/cm035137d ↗
5. 10.1002/polb.2027110.1002/polb.20271 ↗
6. 10.1021/ma030548110.1021/ma0305481 ↗
7. 10.1021/ma048757o10.1021/ma048757o ↗
8. 10.1002/polb.1031510.1002/polb.10315 ↗
9. 10.1016/j.polymer.2006.09.04910.1016/j.polymer.2006.09.049 ↗
10. 10.1016/j.polymer.2005.01.06310.1016/j.polymer.2005.01.063 ↗
11. 10.1016/j.compscitech.2006.08.00610.1016/j.compscitech.2006.08.006 ↗
12. 10.1016/j.compositesa.2006.03.00510.1016/j.compositesa.2006.03.005 ↗
13. 10.1002/app.2856010.1002/app.28560 ↗
14. 10.1002/pen.2162210.1002/pen.21622 ↗
15. 10.1016/j.polymer.2008.01.04510.1016/j.polymer.2008.01.045 ↗
16. 10.1016/S0032-3861(96)00702-110.1016/S0032-3861(96)00702-1 ↗
17. 10.1016/0032-3861(92)90984-510.1016/0032-3861(92)90984-5 ↗
18. 10.1016/j.polymer.2005.11.08810.1016/j.polymer.2005.11.088 ↗
19. 10.1016/j.polymer.2005.11.08710.1016/j.polymer.2005.11.087 ↗
20. 10.1016/j.polymer.2004.04.00210.1016/j.polymer.2004.04.002 ↗
21. 10.1016/j.eurpolymj.2004.10.04110.1016/j.eurpolymj.2004.10.041 ↗
22. 10.1016/j.polymer.2005.05.14510.1016/j.polymer.2005.05.145 ↗
23. 10.1002/polb.2036010.1002/polb.20360 ↗
24. 10.1021/ma902232g10.1021/ma902232g ↗
25. 10.1016/j.polymer.2007.03.05910.1016/j.polymer.2007.03.059 ↗
26. 10.1002/pc.2237210.1002/pc.22372 ↗
27. 10.1002/app.3366210.1002/app.33662 ↗
28. 10.1016/S0032-3861(97)00583-110.1016/S0032-3861(97)00583-1 ↗
29. 10.1002/app.1150210.1002/app.11502 ↗
30. 10.1002/app.2823810.1002/app.28238 ↗
31. 10.1002/mame.20039004010.1002/mame.200390040 ↗
32. 10.1021/ma035207210.1021/ma0352072 ↗
33. 10.1016/j.polymer.2005.09.07710.1016/j.polymer.2005.09.077 ↗
34. 10.1016/S0032-3861(99)00106-810.1016/S0032-3861(99)00106-8 ↗
35. 10.1002/(SICI)1099-0488(19990915)37:18<2664::AID-POLB10>3.0.CO;2-O10.1002/(SICI)1099-0488(19990915)37:18<2664::AID-POLB10>3.0.CO;2-O ↗
36. 10.1002/pola.1988.08026101510.1002/pola.1988.080261015 ↗
37. 10.1016/j.compscitech.2005.03.02010.1016/j.compscitech.2005.03.020 ↗