Process‐induced effects in thin‐film bonding of PEKEKK in metal‐polymer joints

Abstract In this work, poly ether ketone ether ketone ketone (PEKEKK) was used as a thermoplastic adhesive for joining metals. Titanium and cobalt chromium alloys were joined to form tensile butt joints. These tensile specimens were used to evaluate bond performance. A controlled thermal processing cycle was used to modify and enhance the polymer crystallinity during bonding. The resulting effects on bond performance were examined. The process window for a thermal bonding process was identified. Factorial experiments were conducted to determine the effects of modifications to adhesive and adherend material, and bonding pressure on bond performance. A titanium alloy and a cobalt chromium alloy were used as the adherends. Understanding changes in the thermoplastic adhesive joint with the variation of process parameters will allow for proper application and processing of thermoplastic structural adhesives.