journal article·1999-08

Use of a simple, inexpensive pressure sensor to measure hydrostatic resin pressure during processing of composite laminates

Katherine Lynch, Pascal Hubert, Anoush Poursartip

Polymer Composites· Volume 20· Issue 4
Publisher page

Abstract

Abstract A simple and cheap method of measuring the resin pressure within a composite laminate during processing is presented. The method consists of using a small diameter, long needle filled with inert fluid and connected to an external pressure sensor, to measure the resin pressure at a point inside a composite laminate. This method can be used to investigate resin flow, laminate compaction, the control of voids, and in several composite material processing methods such as autoclave processing, hot press curing and resin transfer molding. The sensors are suitable for research and development or troubleshooting, but not for production. Sensor assemblies were developed and tested to show that their response is reproducible, linear and stable with temperature and time. Resin pressure profiles for two AS4/3501‐6 laminates were generated and compared. The experimental results were also compared to the resin flow simulation of a general processing model for composites, COMPRO. It is shown that the resin profile in the laminate is influenced by the presence of the bleeder cloth and the vacuum bag pressure. A significant pressure drop corresponded to the point of minimum viscosity of the resin. Finally, the resin pressure was stabilized when the resin reached gelation.
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Research context

OpenAlex topics: Epoxy Resin Curing Processes · Mechanical Behavior of Composites · Material Properties and Processing

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (18)

Show source-provided references
1. 10.1177/07316844980170040210.1177/073168449801700402 ↗
2. Gutowski T. G. · 1985 · 295
3. 10.1177/00219983930270170410.1177/002199839302701704 ↗
4. 10.1177/00219983830170020410.1177/002199838301700204 ↗
5. Hubert P. · 1995 · 149
6. 10.1002/(SICI)1097-0207(19990110)44:1<1::AID-NME481>3.0.CO;2-K10.1002/(SICI)1097-0207(19990110)44:1<1::AID-NME481>3.0.CO;2-K ↗
7. Loos A. C. · 1985 · 119
8. Gotro J. T. · SPE ANTEC Tech. Papers · 1986 · 32 · 371
9. 10.1002/pen.76032040310.1002/pen.760320403 ↗
10. 10.1002/pc.75013010910.1002/pc.750130109 ↗
11. Roberts R. W. · 1987 · 755
12. Frank‐Susich D. · 1992 · 1075
13. Smith G. D. · 1992
14. Metricor Inc. Sensors(May1989).
15. Cable D. · 1990
16. 10.1002/pc.75008020910.1002/pc.750080209 ↗
17. 10.1177/00219983870210020710.1177/002199838702100207 ↗
18. Smith G. D. · 1991