Preparation and characterization of PA66 composites by waste printed circuit board non‐metallic fractions

Abstract With the rapid advancement of contemporary technology, there has been a significant increase in electronic waste (e‐waste). The recycling of waste printed circuit board (WPCB) plays a crucial role in this context. The non‐metallic fractions (NMFs) derived from waste PCBs primarily consist of cured resin and fiber. In this study, NMF material from a PCB was ground into a powder and incorporated into a matrix of PA66 to produce PCB‐NMFs‐modified PA66. NMFs treated with inorganic acids are designated as I‐NMFs, while those treated with decanoic acid are referred to as DA‐NMFs. The results indicated that the use of reactive compatibilizers, specifically POE‐g‐MAH (15 parts), significantly enhances the properties of the composites. Among the chemical treatments applied to the NMFs, decanoic acid and n‐heptanoic acid were found to most effectively improve the impact strength of PA66 composites. In this study, decanoic acid was selected as the organic reagent for the treatment of NMFs, with an application amount of 6% relative to the mass of the NMFs. Notably, when DA‐NPCB was filled with 20% and the particle size was reduced to below 100 mesh, its impact strength reached 92.73 kJ/m², representing an increase of 103.36%. Overall, utilizing PCB‐NMFs as a modifier for PA66 presents a promising and sustainable approach that not only reduces the processing costs associated with electronics but also enhances the performance of the plastic. Highlights PP‐g‐MAH can increase the bending and tensile stresses of composites. POE‐g‐MAH improves toughness and impact strength of composites. Twice as much increase in impact strength of decanoic acid‐treated composites. Realization of circuit board non‐metallic fractions resource utilization. Modifying and enhancing the properties of PA66 composites.