Impact of multi‐function SiO₂‐nanoscale ionic materials on the curing kinetics of epoxy resin: New approach to improve curing characteristics of thermoset polymers

Abstract Epoxy resins (EP), as significant thermosetting macromolecules, are widely used in various engineering applications due to their wide range of properties. However, the poor control over curing process of EP, limits their manufacturing process. Here, a SiO₂‐nanoscale ionic materials (SiO₂‐NIMs)/EP nanocomposite was prepared. The Friedman, Kissinger, Ozawa, Málek, and Friedman autocatalytic models were used to determine kinetic parameters and reaction models, which demonstrates that the SiO₂‐NIMs improve the curing characteristics of EP through an exclusive mechanism. The solvent role of SiO₂‐NIMs decreased viscosity and increased reactant mobility, leading to increased curing reactivity. The multi‐function groups in the corona‐canopy make multiple hydrogen bonding and proton transfer interactions in EP resin, leading to the autocatalytic curing mechanism and effectiveness of treatments. The frequency factor of EP increased by 9% with the addition of SiO₂‐NIMs. The differential scanning calorimetry tests revealed that SiO₂‐NIMs decreased T_onset and T_peak compared to EP. The non‐isothermal rheometric mechanical spectrometery (RMS) test indicated that SiO₂‐NIMs decreased the T_gel of EP resin from 75 to 71°C and increased the initial storage modulus by 90.9%. This study introduces SiO₂‐NIMs as significant fillers to enhance control over the process conditions and curing kinetic of EP resin for advanced applications such as aerospace and satellite industries. Highlights Introducing new catalyst based on 3D‐dynamic networks strategy of SiO₂‐NIMs. The SiO₂‐NIMs show great potential in improving curing characteristics of EP. The SiO₂‐NIMs increase the frequency factor of EP by 9%. The RMS test indicated SiO₂‐NIMs increased initial storage modulus by 90.9%. The Fourier transform infrared spectroscopy analysis indicated that SiO₂‐NIMs accelerate curing process of EP.