journal article·2023-03

A dual‐scale three‐dimensional thermo‐viscoelastic model for the hot stamping simulation of thermoplastic composites

Lingyu Yue, Yingdan Zhu, Dong Liu, Chun Yan, Gang Chen, Mingda Chen

Polymer Composites· Volume 44· Issue 3
Publisher page

Abstract

Abstract Existing hot stamping simulations are performed at the macroscopic scale, making optimizing process parameters for a new composite system time‐consuming. This paper develops a dual‐scale three‐dimensional thermos‐viscoelastic model based on a numerical homogenization approach to accurately predict the structural deformation of thermoplastic composite laminates during hot stamping. The viscoelastic homogenization model is developed on representative volume elements using temperature‐dependent viscoelastic parameters determined from thermo‐mechanical tests. The effective properties of the composites are identified from the homogenization results, which are then combined with the experimentally measured thermal behavior into a numerical model of the hot stamping process. The developed model is validated by the agreement between the finite element homogenization results and the predictions made using the determined parameters. The simulated warpage of the molded part also agrees well with the experimental measurements. The developed dual‐scale model can be used to predict the effective thermomechanical properties of composites. Moreover, it can also be integrated into numerical tools for structural design and process optimization of thermoplastic composites.
Source: crossref · Quality: baseline

Research context

OpenAlex topics: Composite Material Mechanics · Epoxy Resin Curing Processes · Mechanical Behavior of Composites

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Zhejiang Provincial Key Laboratory of Robotics and Intelligent Manufacturing Equipment Technology, Ningbo Institute of Materials Technology and Engineering Chinese Academy of Sciences Ningbo China

Center of Materials Science and Optoelectronics Engineering University of Chinese Academy of Sciences Beijing China

Funding

National Natural Science Foundation of China · Natural Science Foundation of Zhejiang Province

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