Shape memory effect and thermal conductivity of PLA/h‐BN composites
Source abstract
Abstract
Abstract The use of polylactic acid‐based composites as self‐fixing materials is a promising technology for various applications due to the shape memory effect of polylactide. In this study, hexagonal boron nitride (h‐BN) was mixed with polylactic acid (PLA) with concentrations of 0, 0.5, 1, 2, 5, and 10 wt% for subsequent film casting. The morphology, mechanical and thermal characteristics of the composite were investigated. With a high percentage of filler content, a decrease in thermal conductivity was observed. The recovery strain decreased with increasing the filler content. The amount of h‐BN had a mixed effect on the recovery stress of the composite. Thus, PLA/h‐BN composites represent a new research idea to study the influence of a heat‐conducting filler on a shape memory effect in polylactic acid. Highlights Correlation between crystallinity, thermal and shape memory properties was described Decrease in thermal conductivity was observed with the large percentage of filling The composite with 2 wt% of h‐BN exhibits optimal characteristics of SME Recovery strain decreased with the rise of filler content Amount of h‐BN had a non‐trivial effect on the recovery stress of composite
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Polymer composites and self-healing · biodegradable polymer synthesis and properties · Electrospun Nanofibers in Biomedical Applications
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Institute of New Materials and Nanotechnologies National University of Science and Technology “MISIS” Moscow Russian Federation
Funding
Ministry of Science and Higher Education of the Russian Federation · National University of Science and Technology
References (33)
Show source-provided references
1. 10.1016/j.engreg.2020.08.00210.1016/j.engreg.2020.08.002 ↗
2. 10.1016/j.matdes.2011.04.06510.1016/j.matdes.2011.04.065 ↗
3. 10.1002/1527‐2648(200203)4:3<91::aid‐adem91>3.0.co;2‐b10.1002/1527‐2648(200203)4:3<91::aid‐adem91>3.0.co;2‐b ↗
4. 10.1108/0144515091097289510.1108/01445150910972895 ↗
5. 10.1016/j.eurpolymj.2017.06.01110.1016/j.eurpolymj.2017.06.011 ↗
6. 10.1016/j.polymer.2013.02.02310.1016/j.polymer.2013.02.023 ↗
7. 10.1016/j.progpolymsci.2015.04.00110.1016/j.progpolymsci.2015.04.001 ↗
8. 10.1039/C0SM00487A10.1039/C0SM00487A ↗
9. 10.1126/science.114559310.1126/science.1145593 ↗
10. 10.1016/j.mser.2018.06.00210.1016/j.mser.2018.06.002 ↗
11. 10.1016/j.compositesa.2004.03.00110.1016/j.compositesa.2004.03.001 ↗
12. 10.1002/pc.2568310.1002/pc.25683 ↗
13. 10.1016/j.compscitech.2019.10769210.1016/j.compscitech.2019.107692 ↗
14. 10.1021/nl304060g10.1021/nl304060g ↗
15. 10.1103/PhysRevB.84.15542110.1103/PhysRevB.84.155421 ↗
16. 10.1557/proc‐855‐w4.710.1557/proc‐855‐w4.7 ↗
17. 10.1002/pc.2028310.1002/pc.20283 ↗
18. LiuC MatherPT.High thermal conductivity shape memory polymers. ANTEC 2004‐Annual Technical Conference Proceedings.2004.
19. 10.1016/j.msec.2018.12.00310.1016/j.msec.2018.12.003 ↗
20. 10.1016/j.jmbbm.2021.10476410.1016/j.jmbbm.2021.104764 ↗
21. 10.1016/j.mtla.2021.10107510.1016/j.mtla.2021.101075 ↗
22. 10.1016/j.jtice.2019.08.01810.1016/j.jtice.2019.08.018 ↗
23. 10.1021/ma035594f10.1021/ma035594f ↗
24. 10.1016/j.cossms.2003.10.00610.1016/j.cossms.2003.10.006 ↗
25. 10.1002/1439‐2054(20020601)287:6<395::AID‐MAME395>3.0.CO;2‐S10.1002/1439‐2054(20020601)287:6<395::AID‐MAME395>3.0.CO;2‐S ↗
26. Ingeo™ Biopolymer 4032D Technical Data Sheet.http://www.natureworksllc.com/~/media/Technical_Resources/Technical_Data_Sheets/TechnicalDataSheet_4032D_films_pdf.pdf 2015 (accessed 07 September 2021)
27. 10.1002/app.2726110.1002/app.27261 ↗
28. 10.1002/app.3871510.1002/app.38715 ↗
29. 10.1016/j.jmst.2021.06.01510.1016/j.jmst.2021.06.015 ↗
30. 10.1016/j.polymdegradstab.2010.05.01110.1016/j.polymdegradstab.2010.05.011 ↗
31. 10.1002/adma.20221164210.1002/adma.202211642 ↗
32. 10.1007/s12274‐023‐5594‐110.1007/s12274‐023‐5594‐1 ↗
33. 10.1016/j.jmst.2021.01.01810.1016/j.jmst.2021.01.018 ↗