Electrical, thermal, and mechanical properties of polypropylene/multiwalled carbon nanotube micromoldings
Source abstract
Abstract
Abstract In this paper, properties of microparts molded from polypropylene/multiwalled carbon nanotubes (PP/CNT) composites were studied in detail. Results indicated that the percolation threshold of PP/CNT microparts shifted to higher filler concentrations when compared with their compression molded counterparts. Morphology observations revealed that the distribution of CNT is not uniform along the flow direction, which can significantly affect the properties of microparts. The thermal properties of PP and PP/CNT composites as well as corresponding microparts were investigated using differential scanning calorimetry and thermogravimetric analysis, respectively. Moreover, the mechanical properties of microparts were evaluated by nanoindentation analysis. Multicycling measurements indicated that the mechanical properties of microparts are both depth and location dependent. Both the hardness and elastic modulus increased with corresponding filler loading concentration of CNT below 3 and 7 wt%, respectively. Above those concentrations, both properties decreased with an increase of CNT concentration. This could be related to the state of filler distribution within the microparts.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Carbon Nanotubes in Composites · Polymer crystallization and properties · Advanced Sensor and Energy Harvesting Materials
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
The State Key Laboratory of Polymer Materials Engineering Polymer Research Institute of Sichuan University Chengdu Sichuan China
Department of Chemical and Biochemical Engineering The University of Western Ontario London Ontario Canada
Department of Chemical Engineering McGill University Montréal Québec Canada
Funding
China Scholarship Council · Fundamental Research Funds for the Central Universities · Natural Sciences and Engineering Research Council of Canada
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