A comparative study on thermal conductivity and permittivity of composites based on linear low‐density polyethylene and poly(lactic acid) filled with hexagonal boron nitride
Source abstract
Abstract
Abstract Thermal conductivity (λ) and permittivity (ε′) of polymer composites based on linear low‐density polyethylene (LLDPE) and poly(lactic acid) (PLA) filled with hexagonal boron nitride (hBN) were considered in this work. It is found that all developed composites possess dielectric properties and enhancement thermal conductivity compared with neat polymer matrices. Unlike carbonaceous materials (carbon black, graphite, graphene, carbon nanotubes), hBN is a good insulator and is therefore more applicable as a filler for heat‐releasing materials with a purely white appearance. At the same time, both LLDPE/hBN and PLA/hBN composites at 40 wt% filler content possess the comparable value of λ about 0.7 W/(m K), which is almost 95% and 250% higher than those for the neat LLDPE and PLA, respectively.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Thermal properties of materials · Dielectric materials and actuators · Tribology and Wear Analysis
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Engineering School of Advanced Manufacturing Technologies Tomsk Polytechnic University Tomsk Russia
Funding
Tomsk Polytechnic University
References (35)
Show source-provided references
1. 10.1007/s10853-009-3695-110.1007/s10853-009-3695-1 ↗
2. 10.1002/polb.1014110.1002/polb.10141 ↗
3. 10.1016/j.carbon.2007.05.01010.1016/j.carbon.2007.05.010 ↗
4. 10.1002/app.2404410.1002/app.24044 ↗
5. 10.1016/j.applthermaleng.2015.08.04610.1016/j.applthermaleng.2015.08.046 ↗
6. 10.1016/j.polymertesting.2016.12.03310.1016/j.polymertesting.2016.12.033 ↗
7. 10.1016/j.compositesb.2016.10.05810.1016/j.compositesb.2016.10.058 ↗
8. 10.1007/s10965-015-0755-x10.1007/s10965-015-0755-x ↗
9. http://ocsial.com.
10. Kharitonov E. V. · 1983
11. Stauffer D. A. · 1992
12. 10.1016/j.spmi.2003.11.01110.1016/j.spmi.2003.11.011 ↗
13. 10.1063/1.180887410.1063/1.1808874 ↗
14. 10.1016/j.polymer.2006.01.02910.1016/j.polymer.2006.01.029 ↗
15. Kapitza P. L. · 1965 · 581
16. 10.1016/0956-7151(92)90205-S10.1016/0956-7151(92)90205-S ↗
17. 10.1063/1.35320610.1063/1.353206 ↗
18. 10.1103/PhysRevLett.75.406710.1103/PhysRevLett.75.4067 ↗
19. 10.1063/1.36520910.1063/1.365209 ↗
20. 10.1016/j.progpolymsci.2010.11.00410.1016/j.progpolymsci.2010.11.004 ↗
21. 10.1016/j.compositesa.2018.03.02110.1016/j.compositesa.2018.03.021 ↗
22. 10.1002/pc.2614010.1002/pc.26140 ↗
23. 10.1038/s41598-018-19945-310.1038/s41598-018-19945-3 ↗
24. 10.1016/j.compositesa.2017.12.03110.1016/j.compositesa.2017.12.031 ↗
25. 10.1002/app.4866110.1002/app.48661 ↗
26. 10.1016/j.materresbull.2006.11.04710.1016/j.materresbull.2006.11.047 ↗
27. 10.1016/j.ijheatmasstransfer.2017.12.01510.1016/j.ijheatmasstransfer.2017.12.015 ↗
28. 10.3390/nano1108189810.3390/nano11081898 ↗
29. 10.1002/pc.2550110.1002/pc.25501 ↗
30. 10.1166/jbmb.2015.151610.1166/jbmb.2015.1516 ↗
31. Chandar J. V. · Polym. Plast. Techn. Mater. · 2020 · 60 · 59
32. 10.1063/1.113849110.1063/1.1138491 ↗
33. User's Manual of Transient Hot Bridge Analyzer THB‐1002013 www.linseis.com.
34. 10.1038/s41699-018-0050-x10.1038/s41699-018-0050-x ↗
35. 10.1080/1060132960801088010.1080/10601329608010880 ↗