High performance self‐healing bismaleimide/diallylbisphenol a/poly(phenylene oxide) microcapsules composites with low temperature processability

Abstract Novel high performance self‐healing 4,4′‐bismaleimidodiphenylmethane (BDM)/diallylbisphenol A(BA)/poly(phenylene oxide) microcapsules filled with epoxy resin (PPOMCs) systems with low temperature processability were developed. The effects of PPOMCs on the reactivity of BDM/BA resin system were investigated; the properties of cured BDM/BA/PPOMCs systems such as fracture toughness, dynamic mechanical property, dielectric property, and self‐healing ability were discussed. The morphologies of the cured resin systems were characterized using scanning electronic microscope and light microscopy. Results reveal that the addition of PPOMCs can catalyze the polymerization reaction of BDM/BA resins. BDM/BA systems with appropriate PPOMCs content cured at low temperature possess excellent fracture toughness, high glass transition temperature (T_g), and low dielectric property. The self‐healing ability of BDM/BA can be realized by the introduction of PPOMCs owing to the polymerization of the released core materials from PPOMCs. The self‐healing efficiency of healed BDM/BA/PPOMCs systems can be influenced by the size and content of PPOMCs and the contact areas between the crack surfaces. © 2013 Society of Plastics Engineers