Effects of surface‐functionalized aluminum nitride on thermal, electrical, and mechanical behaviors of polyarylene ether nitrile‐based composites
Source abstract
Abstract
Aluminum nitride (AlN) with high thermal conductivity was blended in polyarylene ether nitrile (PEN) to obtain a composite system. A ball milling process could provide AlN particles of smaller size with higher surface silylation for homogeneous particle distribution in polymeric matrix. Thermal, electrical, and mechanical behaviors of the produced composites were characterized to investigate the effects of particles on the performance of PEN‐based composites with functionalized AlN. The composite exhibited thermal conductivity of 0.779 W m−1 K−1, a dielectric constant of 7.7, dielectric loss of 0.032, electrical resistivity of 1.39 GΩ.cm, and break strength of 36 N when the fraction of functionalized AlN increased to 42.3 vol%. A fitted equation based on the improved Russell's model could effectively predict a trend for thermal conductivity of the composite systems with consideration of interfacial resistance between AlN and surrounding PEN. POLYM. COMPOS., 37:3033–3041, 2016. © 2015 Society of Plastics Engineers
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Dielectric materials and actuators · Thermal properties of materials · Polymer Nanocomposites and Properties
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China Chengdu China
Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University Loughborough United Kingdom
Department of Mathematical Sciences Loughborough University Loughborough United Kingdom
Research and Development Department Bomin Electronic Co., Ltd Meizhou China
Funding
Key Project of Science and Technology Planning of the Guangdong Province China · China Scholarship Council
References (36)
Show source-provided references
1. 10.1016/j.tsf.2009.05.01910.1016/j.tsf.2009.05.019 ↗
2. 10.1021/cm052777310.1021/cm0527773 ↗
3. 10.1016/j.mseb.2004.01.02210.1016/j.mseb.2004.01.022 ↗
4. 10.1002/pc.2324510.1002/pc.23245 ↗
5. 10.1016/j.electacta.2013.12.11210.1016/j.electacta.2013.12.112 ↗
6. 10.1016/j.carbon.2008.02.00810.1016/j.carbon.2008.02.008 ↗
7. 10.1002/adma.20080040110.1002/adma.200800401 ↗
8. 10.1016/j.progpolymsci.2010.11.00410.1016/j.progpolymsci.2010.11.004 ↗
9. 10.1063/1.222187410.1063/1.2221874 ↗
10. 10.1016/j.carbon.2009.11.04010.1016/j.carbon.2009.11.040 ↗
11. 10.1016/j.tca.2004.12.02410.1016/j.tca.2004.12.024 ↗
12. 10.1016/j.compositesa.2009.04.00510.1016/j.compositesa.2009.04.005 ↗
13. 10.1016/j.compositesa.2009.10.01910.1016/j.compositesa.2009.10.019 ↗
14. Chen Y. · J. Appl. Polym. Sci. · 2015 · 132 · 4188910.1002/app.41889 ↗
15. 10.1002/app.2702710.1002/app.27027 ↗
16. 10.1002/pc.2266710.1002/pc.22667 ↗
17. 10.1002/app.4159510.1002/app.41595 ↗
18. 10.1002/pc.2262610.1002/pc.22626 ↗
19. 10.1016/j.carbon.2011.06.09510.1016/j.carbon.2011.06.095 ↗
20. 10.1002/pc.2280710.1002/pc.22807 ↗
21. 10.3144/expresspolymlett.2011.1410.3144/expresspolymlett.2011.14 ↗
22. 10.1002/anie.20120055810.1002/anie.201200558 ↗
23. 10.1016/j.progpolymsci.2011.05.00210.1016/j.progpolymsci.2011.05.002 ↗
24. 10.1016/j.conbuildmat.2005.12.02010.1016/j.conbuildmat.2005.12.020 ↗
25. 10.1002/adma.20090032310.1002/adma.200900323 ↗
26. 10.1016/S1002-0721(07)60515-810.1016/S1002-0721(07)60515-8 ↗
27. 10.1016/j.compositesa.2010.03.00510.1016/j.compositesa.2010.03.005 ↗
28. 10.1039/c0jm01620a10.1039/c0jm01620a ↗
29. 10.1038/nnano.2008.9610.1038/nnano.2008.96 ↗
30. 10.1080/03602559.2010.51232610.1080/03602559.2010.512326 ↗
31. 10.1002/pi.455610.1002/pi.4556 ↗
32. 10.1063/1.233715710.1063/1.2337157 ↗
33. 10.1002/pc.1041710.1002/pc.10417 ↗
34. 10.1016/j.compscitech.2007.05.02110.1016/j.compscitech.2007.05.021 ↗
35. 10.1021/ma001576b10.1021/ma001576b ↗
36. 10.1016/j.cplett.2004.07.04710.1016/j.cplett.2004.07.047 ↗