Mechanical, thermal conductive, and dielectric properties of fluoroelastomer/reduced graphene oxide composites in situ prepared by solvent thermal reduction

Fluoroelastomer (FKM)/reduced graphene oxide (rGO) composites are in situ prepared by solvent thermal reduction method in N,N‐dimethylformamide (DMF) solution. The reduction of graphene oxide (GO) is characterized by X‐Ray photoelectron (XPS), ultraviolet–visible (UV–vis), and Fourier transform infrared (FTIR) spectra. GO and rGO are both efficient fillers to improve the mechanical properties of FKM. The dispersibility of rGO is improved after solvent thermal reduction which is confirmed by scanning electron micrograph (SEM) and X‐ray diffraction (XRD). The homogenous suspension of FKM/rGO composites in DMF can stay stable for more than a month. The dielectric permittivity of FKM/rGO (5 phr) is 26.4 at the frequency of 10⁻¹ Hz, higher than the pure FKM (8.1). The thermal conductivity of rGO/FKM composites increases. POLYM. COMPOS., 35:1779–1785, 2014. © 2013 Society of Plastics Engineers