journal article·2024-12-13

Oligosiloxane-Based Epoxy Vitrimers: Adaptable Thermosetting Networks with Dual Dynamic Bonds

Amelia A. Putnam-Neeb, Alex Stafford, Sachin Babu, Steven J. Chapman, Christina M. Hemmingsen, Md. Sherajul Islam, Ajit K. Roy, Julia A. Kalow, Vikas Varshney, Dhriti Nepal, Luke A. Baldwin

ACS Applied Polymer Materials· Volume 6· Issue 23
Publisher page

Abstract

Embedding dynamic covalent bonds into polymer compositions transforms static thermosets into active materials with the reprocessability of thermoplastics and the bulk properties of cross-linked networks. This class of next-generation materials, called covalent adaptable networks, shows significant promise in composites, soft optoelectronics, and robotics. Herein, we synthesized two oligosiloxane-based epoxy networks that provide fast dynamic bond exchange. Oligosiloxane diepoxides were cured with stoichiometric amounts of 1,2-phenylenediacetic acid to generate epoxy acid networks with two dynamic covalent bonding mechanisms. The resulting polymer networks provided access to fast stress-relaxation times (1–10 min) at temperatures of only 130 °C with excellent reprocessability.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Polymer composites and self-healing · Silicone and Siloxane Chemistry · Synthetic Organic Chemistry Methods

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Air Force Research Laboratory, Wright Patterson Air Force Base, Dayton, Ohio 45433, United States

UES, Inc., Dayton, Ohio 45432, United States

Department of Chemistry, Northwestern University, 2145 Sheridan Road, Evanston, Illinois 60208, United States

Spectral Energies, LLC, Dayton, Ohio 45430, United States

Funding

Division of Chemistry · Air Force Office of Scientific Research · Arnold and Mabel Beckman Foundation · National Science Foundation

References (35)

Show source-provided references
1. Kausar A. · Am. J. Polym. Sci. Eng. · 2017 · 5 · 1
2. 10.3390/polym1419415310.3390/polym14194153 ↗
3. 10.1039/D2MA00654E10.1039/D2MA00654E ↗
4. 10.1002/adma.20190687610.1002/adma.201906876 ↗
5. 10.1039/D0SC00605J10.1039/D0SC00605J ↗
6. 10.1039/D3LP00012E10.1039/D3LP00012E ↗
7. 10.1002/adfm.20230028810.1002/adfm.202300288 ↗
8. 10.1021/acsmacrolett.3c0011610.1021/acsmacrolett.3c00116 ↗
9. 10.1002/anie.20221040510.1002/anie.202210405 ↗
10. 10.1021/jacs.9b0887610.1021/jacs.9b08876 ↗
11. 10.1038/s41598-020-63508-410.1038/s41598-020-63508-4 ↗
12. 10.1007/s42114-022-00558-410.1007/s42114-022-00558-4 ↗
13. 10.1038/s41467-021-25508-410.1038/s41467-021-25508-4 ↗
14. 10.1002/mame.20220061510.1002/mame.202200615 ↗
15. 10.1021/jacs.2c0351810.1021/jacs.2c03518 ↗
16. 10.1002/marc.20230002010.1002/marc.202300020 ↗
17. 10.1016/j.compositesb.2023.11066610.1016/j.compositesb.2023.110666 ↗
18. 10.1021/acsapm.3c0175210.1021/acsapm.3c01752 ↗
19. 10.1021/acsapm.3c0156010.1021/acsapm.3c01560 ↗
20. 10.1039/D3RA01039B10.1039/D3RA01039B ↗
21. 10.1021/acsmacrolett.2c0071510.1021/acsmacrolett.2c00715 ↗
22. 10.1021/acsmacrolett.0c0026510.1021/acsmacrolett.0c00265 ↗
23. 10.1039/D0PY00233J10.1039/D0PY00233J ↗
24. 10.1038/nmat440110.1038/nmat4401 ↗
25. 10.1002/mats.20190000510.1002/mats.201900005 ↗
26. 10.1021/acs.jpcb.0c1040310.1021/acs.jpcb.0c10403 ↗
27. 10.1021/j100091a02410.1021/j100091a024 ↗
28. 10.1021/j100096a00110.1021/j100096a001 ↗
29. Cramer C. J. · 2004
30. 10.1016/j.cpc.2010.04.01810.1016/j.cpc.2010.04.018 ↗
31. 10.1002/jcc.54004030310.1002/jcc.540040303 ↗
32. 10.1063/1.44707910.1063/1.447079 ↗
33. 10.1021/acsapm.3c0173810.1021/acsapm.3c01738 ↗
34. 10.1039/C6RA18010H10.1039/C6RA18010H ↗
35. 10.1002/anie.20231098910.1002/anie.202310989 ↗