Sn Incorporation in Ultrathin InAs Nanowires for Next-Generation Transistors Characterized by Atom Probe Tomography
Source abstract
Abstract
Growth of ultrathin semiconducting nanowires (NWs) and incorporation of dopants suitable for future CMOS scaling targets (diameter <20 nm) is a challenge. Limits on dopant incorporation in thin NWs have led to concerns about the suitability of these structures. In this work, the atomic structure of the thinnest InAs NWs ever reported, down to 7 nm diameter, is characterized using transmission electron microscopy (TEM) and atom probe tomography (APT). It is demonstrated that there is no fundamental limit of Sn incorporation into ultrathin InAs NWs. Additionally, the Sn distribution of the Au catalyst particle controlling the growth is characterized.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Advanced Materials Characterization Techniques · Nanowire Synthesis and Applications · Surface and Thin Film Phenomena
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Taiwan Semiconductor Manufacturing Company, Ltd., 166, Park Avenue II, Hsinchu Science Park, Hsinchu 30075, Taiwan
TSMC R&D Europe B.V., Kapeldreef 75, 3001 Leuven, Belgium
Funding
Taiwan Semiconductor Manufacturing Company
References (30)
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