journal article·2025-10-17Open access

Density Functional Theory Study of Engineering TiS2 Work Function through Intrinsic Defects and Surface Oxidation for Field-Effect Transistors

Yee-Heng Teh, Sheng-Hsiung Hung, Chin-Hsuan Chen, Angus Huang, Jer-Fu Wang, Chih-Piao Chuu, Horng-Tay Jeng

ACS Applied Nano Materials· Volume 8· Issue 41

Abstract

High Resolution Image Download MS PowerPoint Slide TiS 2 is a van der Waals-layered semiconductor while being highly susceptible to interstitial Ti (Ti i ) defects, rendering a high electrical conductivity. Understanding the influence of Ti i concentration, surface defects, and thickness dependence on its work function is essential for designing TiS 2 -based electrodes in field-effect transistor-related applications. In this work, density functional theory is used to investigate the defect, thickness, and substrate effects toward TiS 2 work function. Our results demonstrate that TiS 2 exhibits a remarkably high work function of 5.75 eV. The high work function is slightly reduced to ∼5.6 eV by Ti i defects and is insensitive to thickness and Ti i concentration. We further reveal that surface oxidation and chemisorption of Ti-based adparticles are the causes of low measured TiS 2 work function (4.0–4.5 eV) in experiments. On the other hand, the work function of TiS 2 can be enhanced up to ∼6.1 eV by aluminum oxide (Al 2 O 3 ) substrate while slightly lowered by Ti and Al defects. Our work provides valuable guidance toward engineering high-work-function electrodes in the semiconductor industry.
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Research context

OpenAlex topics: 2D Materials and Applications · Nanowire Synthesis and Applications · MXene and MAX Phase Materials

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Physics

National Tsing Hua University

Corporate Research

Taiwan Semiconductor Manufacturing Company

Physics Division

National Center for Theoretical Sciences

Institute of Physics

Academia Sinica

Research Center for Semiconductor Materials and Advanced Optics

Chung Yuan Christian University

Funding

Academia Sinica · National Tsing Hua University · National Taiwan University · Ministry of Higher Education, Science, Research and Innovation, Thailand · National Science and Technology Council · NCHC · Ministry of Education, Taiwan

References (84)

Show source-provided references
1. 10.1016/j.tsf.2009.02.07410.1016/j.tsf.2009.02.074 ↗
2. 10.1016/j.tsf.2005.12.28810.1016/j.tsf.2005.12.288 ↗
3. 10.1016/j.tsf.2004.08.14810.1016/j.tsf.2004.08.148 ↗
4. 10.1109/led.2002.80260210.1109/led.2002.802602 ↗
5. 10.1116/1.307184310.1116/1.3071843 ↗
6. 10.3390/molecules2712395110.3390/molecules27123951 ↗
7. 10.1063/1.368770210.1063/1.3687702 ↗
8. 10.1063/1.498619610.1063/1.4986196 ↗
9. 10.1109/LED.2008.200083310.1109/LED.2008.2000833 ↗
10. 10.1016/j.vacuum.2018.04.00410.1016/j.vacuum.2018.04.004 ↗
11. 10.1016/j.mee.2011.03.05910.1016/j.mee.2011.03.059 ↗
12. 10.1016/j.mser.2014.11.00110.1016/j.mser.2014.11.001 ↗
13. Takeuchi, H.; Wong, H. Y.; Ha, D.; King, T.J. Impact of oxygen vacancies on high-/spl kappa/gate stack engineering. In IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004, 2004, pp 829–832.10.1109/IEDM.2004.1419305 ↗
14. Datta, S.; Dewey, G.; Doczy, M.; Doyle, B.; Jin, B.; Kavalieros, J.; Kotlyar, R.; Metz, M.; Zelick, N.; Chau, R. High mobility si/sige strained channel mos transistors with hfo/sub 2//tin gate stack. In IEEE International Electron Devices Meeting 2003, 2003, pp 2811–2814.
15. 10.1109/TED.2010.206319110.1109/TED.2010.2063191 ↗
16. 10.1088/2631-8695/ad257c10.1088/2631-8695/ad257c ↗
17. 10.1007/s40820-024-01461-x10.1007/s40820-024-01461-x ↗
18. 10.1038/s41586-021-03339-z10.1038/s41586-021-03339-z ↗
19. 10.1038/natrevmats.2016.5210.1038/natrevmats.2016.52 ↗
20. 10.1039/D1CP01890F10.1039/D1CP01890F ↗
21. 10.1039/C5NR01052G10.1039/C5NR01052G ↗
22. 10.1021/acs.jpcc.0c0265710.1021/acs.jpcc.0c02657 ↗
23. 10.1007/s11837-022-05505-810.1007/s11837-022-05505-8 ↗
24. 10.1002/advs.20150034310.1002/advs.201500343 ↗
25. 10.1063/5.000517010.1063/5.0005170 ↗
26. 10.1021/acsami.8b1342810.1021/acsami.8b13428 ↗
27. 10.1002/aenm.20180321010.1002/aenm.201803210 ↗
28. 10.1002/aenm.20220237710.1002/aenm.202202377 ↗
29. 10.1021/acsenergylett.2c0183810.1021/acsenergylett.2c01838 ↗
30. 10.1039/C6TA01628F10.1039/C6TA01628F ↗
31. 10.1016/j.electacta.2014.08.13910.1016/j.electacta.2014.08.139 ↗
32. 10.1039/C9CP04254G10.1039/C9CP04254G ↗
33. 10.1021/acsenergylett.6b0014510.1021/acsenergylett.6b00145 ↗
34. 10.1021/acsami.5c0405910.1021/acsami.5c04059 ↗
35. Miao, J.; Zhang, H.; Bian, Z.; Zhang, T.; Zhao, Y. Boosting 2d transistor performance via tis2 van der waals contact engineering. In 2025 9th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 2025, pp 1–3.10.1109/EDTM61175.2025.11041504 ↗
36. 10.1126/sciadv.160006910.1126/sciadv.1600069 ↗
37. 10.1038/s41586-021-03472-910.1038/s41586-021-03472-9 ↗
38. 10.1002/adma.20210842510.1002/adma.202108425 ↗
39. 10.1002/advs.20230140010.1002/advs.202301400 ↗
40. 10.1021/acs.jpclett.9b0271010.1021/acs.jpclett.9b02710 ↗
41. 10.1002/cphc.20180103110.1002/cphc.201801031 ↗
42. 10.1109/TNANO.2006.88503510.1109/TNANO.2006.885035 ↗
43. 10.1109/LED.2010.205291210.1109/LED.2010.2052912 ↗
44. 10.1038/nature0179710.1038/nature01797 ↗
45. 10.1063/1.488089910.1063/1.4880899 ↗
46. 10.1021/nl301702r10.1021/nl301702r ↗
47. 10.1021/acsami.6b1089810.1021/acsami.6b10898 ↗
48. 10.1021/nl404350510.1021/nl4043505 ↗
49. 10.1002/smtd.20170025010.1002/smtd.201700250 ↗
50. 10.1016/j.jcat.2020.10.00910.1016/j.jcat.2020.10.009 ↗
51. 10.1016/j.surfcoat.2019.01.01010.1016/j.surfcoat.2019.01.010 ↗
52. 10.1007/s10311-023-01607-010.1007/s10311-023-01607-0 ↗
53. 10.1116/1.500336110.1116/1.5003361 ↗
54. 10.1016/j.apsusc.2023.15747610.1016/j.apsusc.2023.157476 ↗
55. 10.1002/admi.20210111710.1002/admi.202101117 ↗
56. 10.1021/acsami.9b1094010.1021/acsami.9b10940 ↗
57. 10.1021/acsaelm.4c0030910.1021/acsaelm.4c00309 ↗
58. 10.1088/2631-7990/add4d110.1088/2631-7990/add4d1 ↗
59. 10.1103/physrevmaterials.5.12400110.1103/physrevmaterials.5.124001 ↗
60. 10.1088/1361-6528/ab4e4410.1088/1361-6528/ab4e44 ↗
61. 10.1088/1361-648x/ab400710.1088/1361-648x/ab4007 ↗
62. 10.1103/PhysRevB.88.08511710.1103/PhysRevB.88.085117 ↗
63. 10.1103/PhysRevLett.77.386510.1103/PhysRevLett.77.3865 ↗
64. 10.1002/jcc.2049510.1002/jcc.20495 ↗
65. 10.1063/1.240466310.1063/1.2404663 ↗
66. 10.1021/ct100222510.1021/ct1002225 ↗
67. 10.1103/PhysRevB.47.55810.1103/PhysRevB.47.558 ↗
68. 10.1016/0927-0256(96)00008-010.1016/0927-0256(96)00008-0 ↗
69. 10.1038/s41563-017-0012-210.1038/s41563-017-0012-2 ↗
70. 10.1039/C5RA16877E10.1039/C5RA16877E ↗
71. 10.1103/RevModPhys.86.25310.1103/RevModPhys.86.253 ↗
72. 10.1016/0021-9614(86)90132-110.1016/0021-9614(86)90132-1 ↗
73. 10.1063/1.218700610.1063/1.2187006 ↗
74. 10.1063/1.156406010.1063/1.1564060 ↗
75. 10.1103/PhysRevB.80.03520310.1103/PhysRevB.80.035203 ↗
76. 10.1063/1.220459710.1063/1.2204597 ↗
77. 10.1063/1.47293310.1063/1.472933 ↗
78. 10.1002/pssb.20104619510.1002/pssb.201046195 ↗
79. 10.1103/PhysRevB.83.03511910.1103/PhysRevB.83.035119 ↗
80. 10.1103/PhysRev.60.66110.1103/PhysRev.60.661 ↗
81. 10.1103/PhysRevB.68.19540810.1103/PhysRevB.68.195408 ↗
82. 10.1038/s41699-017-0024-410.1038/s41699-017-0024-4 ↗
83. 10.1021/acs.jpcc.5b0321210.1021/acs.jpcc.5b03212 ↗
84. 10.1038/s41598-020-79182-510.1038/s41598-020-79182-5 ↗