Microstructure and thermophysical properties of graphite foam/Sn-Bi alloy composites for use as a thermal sink for electronics
Source abstract
Abstract
Abstract Two mesophase pitch-based graphite foams with densities of 0.62±0.01 (GF1) and 0.84±0.01 g/cm3 (GF2) were prepared by foaming the pitch in an autoclave at 723 K, 6.0 MPa and 763 K, 13.4 MPa, respectively, followed by carbonization at 1273 K for 2 h and graphitization at 2973 K for 0.5 h. The GFs were infiltrated by a Sn-Bi liquid to prepare GF/Sn-Bi alloy composites for use as thermal sinks for electronics. The microstructures and thermophysical properties of the composites were investigated. Results indicated that GF1 had a larger cells and thinner cell walls than GF2. The Sn-Bi liquid was well infiltrated into cells of the GFs, resulting in composites with densities of 5.60±0.01 and 3.83±0.01 g/cm3 for GF1 and GF2, respectively. The thermal diffusivity and coefficient of thermal expansion (CTE) of the GF1/Sn-Bi composite were 51.6±2 mm2/s and 16.6±0.02 ppm/K, respectively. The corresponding values for the GF2/Sn-Bi were 163.1±3 mm2/s and 8.08±0.02 ppm/K. The GF2/Sn-Bi composite had a high thermal diffusivity and a low CTE value matching that of semiconductor chips and packaging materials.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Heat and Mass Transfer in Porous Media · Cellular and Composite Structures · Polymer Foaming and Composites
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (14)
Show source-provided references
1. Memis I. Electronic packaging materials: Properties and selection. Reference module in materials science and materials engineering [Z], 2016.
2. Composites for electronic packaging and thermal management[J]
3. Advanced composites and other advanced materials for electronic packaging thermal management
4. Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging[J]10.1016/j.microrel.2015.10.028 ↗
5. High-thermal-conductivity, mesophase-pitch-derived carbon foams: effect of precursor on structure and properties[J]10.1016/S0008-6223(99)00190-6 ↗
6. High thermal conductivity graphite foam reinforced polymer composites [C]
7. Graphite foams infiltrated with phase change materials as alternative materials for space and terrestrial thermal energy storage applications[J]10.1016/j.carbon.2007.11.003 ↗
8. Metal-matrix composites from graphitic foams and copper et al. SAMPE
9. Mo2C intermediate layers for the wetting and infiltration of graphite foams by liquid copper[J]10.1016/j.carbon.2011.03.038 ↗
10. Huang · 2005
11. Thermal and mechanical properties of graphite foam Wood's alloy composite for thermal energy storage[J]10.1016/j.carbon.2010.01.002 ↗
12. Thermophysical Properties of Inorganic Functional Materials [M]
13. Microstructure and thermophysical properties of graphite foam glass composites[J]10.1016/j.carbon.2010.12.018 ↗
14. Thermal expansion of a novel hybrid SiC foam-SiC particles-Al composites[J]10.1016/j.compscitech.2007.03.020 ↗