journal article·2026-06-24

Dielectric Modulation of Ionization Energetics in Organotin Extreme Ultraviolet Photoresists

Yiwei Zhou, Haoyu He, Jingbin Li, Chuanfu Ju, Sheng Dai, Fenglin Li, Hongxia Hao, Huie Zhu, Han Wang

ACS Applied Materials & Interfaces· Volume 18· Issue 24
Publisher page

Abstract

Tin–oxo clusters are promising candidates for extreme ultraviolet (EUV) photoresists owing to their high absorption cross sections and defined molecular structures. However, the influence of solvent environments on their photoionization behavior remains unclear. Here, density functional theory calculations combined with the solvation model based on density (SMD) were performed to systematically investigate solvent-dependent ionization energies of representative organotin clusters across 179 solvents. All solvents were found to reduce the vertical ionization potential (VIP) relative to vacuum, and 24 solvents were identified as particularly favorable. Correlation analysis shows that the dielectric constant exhibits a strong inverse relationship with VIP, whereas the molecular polarity index displays only moderate relevance. A hydrogen-like dielectric cavity model was further developed, yielding an analytical expression of the form VIP = a /ϵ r + b, which quantitatively describes dielectric stabilization effects. These results provide a physically grounded solvent-selection criterion for enhancing EUV photoresist sensitivity.
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Research context

OpenAlex topics: Ion-surface interactions and analysis · Conducting polymers and applications · Electrowetting and Microfluidic Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

State Key Laboratory of Quantum Functional Materials, School of Physical Science and Technology

ShanghaiTech University

Center for Transformative Science

Zhangjiang Laboratory

Shanghai Artificial Intelligence Laboratory

Funding

ShanghaiTech University · Shanghai Cooperation Organization Science and Technology Partnership Program

References (52)

Show source-provided references
1. 10.1049/iet-cds.2015.032510.1049/iet-cds.2015.0325 ↗
2. 10.1016/j.mattod.2023.05.02710.1016/j.mattod.2023.05.027 ↗
3. 10.1039/D0TC03597A10.1039/D0TC03597A ↗
4. 10.1016/j.mee.2014.04.02410.1016/j.mee.2014.04.024 ↗
5. 10.1039/C9RA08977B10.1039/C9RA08977B ↗
6. 10.1016/B978-0-08-100354-1.00004-110.1016/B978-0-08-100354-1.00004-1 ↗
7. 10.1006/adnd.1993.101310.1006/adnd.1993.1013 ↗
8. 10.1039/D1CP03148A10.1039/D1CP03148A ↗
9. Stern, R. D.; Hutchison, D. C.; Olsen, M. R.; Zakharov, L. N.; Nyman, M.; Persson, K. A. Alkyltin Keggin Clusters as EUVL Photoresist Technology. Proceedings of the International Conference on Extreme Ultraviolet Lithography 2019 ; Monterey, CA, Sept 15–19, 2019; SPIE Vol. 11147, 111471L,10.1117/12.2538639.10.1117/12.2538639 ↗
10. 10.2494/photopolymer.31.24310.2494/photopolymer.31.243 ↗
11. 10.1021/acs.inorgchem.9b0009310.1021/acs.inorgchem.9b00093 ↗
12. 10.1021/acs.nanolett.4c0614010.1021/acs.nanolett.4c06140 ↗
13. 10.1002/anie.20252432010.1002/anie.202524320 ↗
14. 10.1039/C9SC02503K10.1039/C9SC02503K ↗
15. 10.1039/D3NA00131H10.1039/D3NA00131H ↗
16. 10.1021/acs.chemmater.3c0262810.1021/acs.chemmater.3c02628 ↗
17. 10.2494/photopolymer.26.62510.2494/photopolymer.26.625 ↗
18. 10.1021/acsami.9b1900410.1021/acsami.9b19004 ↗
19. Fedynyshyn, T.; Goodman, R.; Cabral, A.; Tarrio, C.; Lucatorto, T. Polymer Photochemistry at the EUV Wavelength. Proceedings of the Advances in Resist Materials and Processing Technology XXVII ; San Jose, CA, Feb 22–24, 2010, SPIE Vol. 7639, 76390A,10.1117/12.845997.10.1117/12.845997 ↗
20. 10.3390/nano1008159310.3390/nano10081593 ↗
21. 10.1021/acsami.5c0958910.1021/acsami.5c09589 ↗
22. 10.1016/j.ccr.2023.21530710.1016/j.ccr.2023.215307 ↗
23. 10.1021/acsami.1c1241110.1021/acsami.1c12411 ↗
24. Ma, J. H.; Wang, H.; Prendergast, D.; Neureuther, A.; Naulleau, P. Excitation Selectivity in Model Tin–Oxo Resist: A Computational Chemistry Perspective. Proceedings of the Extreme Ultraviolet (EUV) Lithography XI ; San Jose, CA, Feb 24–27, 2020; SPIE Vol. 11323, 113231F,10.1117/12.2553055.10.1117/12.2553055 ↗
25. 10.1021/acs.jpca.4c0758510.1021/acs.jpca.4c07585 ↗
26. ASML Holding NV. ASML Integrated Report 2019
27. ASML Holding NV: Veldhoven, Netherlands, 2019.
28. Kim, J.; Zhang, R. M.; Wolfer, E.; Patel, B. K.; Toukhy, M.; Bogusz, Z.; Nagahara, T. Combinatorial Process Optimization for Negative Photo-Imageable Spin-On Dielectrics and Investigation of Post-Apply Bake and Post-Exposure Bake Interactions. Proceedings of the Advances in Resist Materials and Processing Technology XXIX ; San Jose, CA, Feb 13–15, 2012, SPIE Vol. 8325, 83252A,10.1117/12.916453.10.1117/12.916453 ↗
29. 10.1016/j.cej.2024.14881010.1016/j.cej.2024.148810 ↗
30. 10.1021/acsami.4c0129110.1021/acsami.4c01291 ↗
31. 10.1109/LED.2018.288454210.1109/LED.2018.2884542 ↗
32. 10.1016/j.ccr.2013.07.01010.1016/j.ccr.2013.07.010 ↗
33. Harumoto, M.; Miyagi, T.; Kaneyama, K.; Morita, A.; Pieczulewski, C.; Asai, M.; Clark, B. Coat-Develop Track Process for Inorganic EUV Resist. Proceedings of the Extreme Ultraviolet (EUV) Lithography III ; San Jose, CA, Feb 13–16, 2012, SPIE Vol. 8322, 83222C,10.1117/12.916122.10.1117/12.916122 ↗
34. 10.3390/polym1509198810.3390/polym15091988 ↗
35. Ivan, P.; Ashish, R.; Mihir, G.; Danilo De, S.; Hyo Seon, S. To Bake or Not to Bake. The Impact of Prebake in the EUV Resist Process. Proceedings of the Advances in Patterning Materials and Processes XXXIX ; San Jose, CA, April 24–28, 2022, SPIE Vol. 12055, 1205507,10.1117/12.2616094.10.1117/12.2616094 ↗
36. Octavia, P. L.; John, P. S.; Lizhong, Z.; Ralph, R. D. Solvent Content of Thick Photoresist Films. Proceedings of the Advances in Resist Technology and Processing XVII ; Santa Clara, CA, Feb 28–March 1, 2000, SPIE Vol. 3999, pp 442–451,10.1117/12.388328.10.1117/12.388328 ↗
37. 10.1016/j.carbon.2020.09.04810.1016/j.carbon.2020.09.048 ↗
38. 10.1039/b508541a10.1039/b508541a ↗
39. 10.1063/1.338234410.1063/1.3382344 ↗
40. 10.1002/jcc.2175910.1002/jcc.21759 ↗
41. 10.1063/1.130588010.1063/1.1305880 ↗
42. 10.1039/b515623h10.1039/b515623h ↗
43. 10.1002/wcms.8110.1002/wcms.81 ↗
44. 10.1002/jcc.2288510.1002/jcc.22885 ↗
45. 10.1016/j.jmgm.2012.07.00410.1016/j.jmgm.2012.07.004 ↗
46. 10.1063/1.495264710.1063/1.4952647 ↗
47. 10.1002/adfm.20242395710.1002/adfm.202423957 ↗
48. 10.1002/smtd.20230030910.1002/smtd.202300309 ↗
49. 10.1080/0026897610010061110.1080/00268976100100611 ↗
50. Quentin, E.; Najmeh, S.; Hsu, C. C.; Nicola, M.; Angelo, G.; Stefano, N.; Yasin, E.; Michaela, V.; Akira, N.; Tsuyoshi, G.; et al. Influence of the Anion in Tin-Based EUV Photoresists Properties. Proceedings of the Advances in Patterning Materials and Processes XL ; San Jose, CA, Feb 27–March 1, 2023, SPIE Vol. 12498, 124980Z,10.1117/12.2658498.10.1117/12.2658498 ↗
51. National Center for Biotechnology Information. PubChem. Compound Summary ; U.S. National Library of Medicine: Bethesda, MD, 2026; https://pubchem.ncbi.nlm.nih.gov/.
52. 10.1093/oso/9780195094329.003.000810.1093/oso/9780195094329.003.0008 ↗