Surface plasmon enhancement in silver nanowires and bilayer two-dimensional materials
Source abstract
Abstract
In order to improve the low light absorption of two-dimensional (2D) transition metal dichalcogenides (TMDCs), surface plasmon (SP) nanostructures have been widely studied. However, the impact of interlayer twist on such nanostructures has rarely been studied. Here, we construct two different composite structures of silver nanowires (Ag NWs) and pristine bilayer MoS2 (pBLM) or twisted bilayer MoS2 (tBLM). The interlayer twist can further promote the light utilization of MoS2, resulting in an ∼4-fold higher spectral enhancement in Ag/tBLM than that in Ag/pBLM. In addition, the photocurrent and detectivity of the phototransistor based on the Ag/tBLM composite structure were improved by 7-fold and ∼100-fold, respectively, compared to those of the Ag/pBLM phototransistor. Theoretical simulations show that the enhancement of photocurrent can be attributed to the enhancement of the local electric field at the interface between Ag NWs and the tBLM film, which is called the 'hot spot'. These results provide a reference for understanding the modulation mechanism of SPs and interlayer twist on the optoelectronic properties of 2D materials.
Source: europepmc · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: 2D Materials and Applications · Plasmonic and Surface Plasmon Research · Advanced biosensing and bioanalysis techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Zhenjiang Key Laboratory of Advanced Sensing Materials and Devices, School of Mechanical Engineering, Jiangsu University, Zhenjiang 212013, China
Jiangsu Zorrun Semiconductor Co., Ltd, Nantong 226500, China
State Key Laboratory of Transducer Technology, Chinese Academy of Sciences, Shanghai 200050, China
Oujiang Laboratory (Zhejiang Lab for Regenerative Medicine, Vision and Brain Health), Wenzhou, Zhejiang, P.R. China
Funding
Jiangsu Agricultural Science and Technology Innovation Fund
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