Thin-Film Silicon Nanosheet-Based Neuromorphic Assemblies
Source abstract
Abstract
High Resolution Image Download MS PowerPoint Slide We demonstrate neuromorphic behavior in silicon nanosheet (NS) assemblies. We utilized Cl- and H-passivated Si-NSs that were synthesized through topotactic deintercalation of the Zintl phase of CaSi 2 with concentrated HCl at −35 °C. We utilize a silicon-based platform in which we fabricated Au source-drain (S-D) electrodes on SiO 2 /Si wafers by photolithography. We fabricated encapsulated assemblies of Si-NS between gold S-D electrodes at mesoscopic channel lengths (30–80 μm) using solution processing methods. The Si-NS assemblies exhibit novel neuromorphic characteristics in which spiking voltage inputs lead to decaying spiking current outputs, analogous to plasticity known for neuron-synapse systems. Decaying spiking current outputs follow a power-law decay (∼t –β ) with β ∼ 0.7–1.1. DFT and electron-trapping simulations suggest that such neuroplastic characteristics may arise from the charging and release of charge from Si-dangling bonds at the NS surfaces. Higher-frequency measurements also reveal an initial learning phase, where the spiking voltage outputs gradually build up to a maximum value, analogous to the potentiation process in neuron-synapse systems. These observed neuromorphic characteristics indicate that Si-NSs are a promising material for next-generation neuromorphic networks with immense potential for energy-efficient, brain-inspired computing.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Advanced Memory and Neural Computing · Nanowire Synthesis and Applications · ZnO doping and properties
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Microelectronics Research Center and Department of Electrical and Computer Engineering
Iowa State University
Department of Physics and Astronomy
U.S. Department of Energy
Ames National Laboratory
Department of Chemical and Biological Engineering
Funding
Division of Civil, Mechanical and Manufacturing Innovation · Iowa State University
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