Source abstract
Abstract
As the features of electronics are miniaturized, the need for interfacial thermal coupling layers to enhance their thermal transfer efficiency and improve device performance becomes critical. Organic conjugated small molecules possess a unique combination of periodic crystal structures and conjugated units with π electrons, resulting in notable thermal conductivities and molecular structure orientation that facilitates directed heat transfer. Nevertheless, there is a noticeable gap in literatures regarding the thermal properties of organic conjugated small molecules and their potential applications in nanoscale thermal management. Herein, we report the fabrication of high-quality thin films of organic conjugated small molecules. The result reveals that the 2D organic conjugated small molecule thin films exhibit a high cross-plane thermal conductivity of 3.2 W/m K. The increased thermal conductivity is attributed to the well-organized lattice structure and existence of π-electrons induced by conjugated systems. The studied conjugated small molecules engage in π-π stacking interactions with carbon materials and efficiently exchange energy with electrons in metals, promoting rapid interfacial heat transfer. These molecules act as coupling layers, significantly enhancing thermal transfer efficiency between graphite-based thermal pads and copper heat sinks. This pioneering research represents the inaugural investigation of the thermal performance of conjugated organic small molecules. These findings highlight the potential of conjugated small molecules as thermal coupling layers, offering tunable combinations of desirable properties.
Source: openalex_inverted_index · Quality: baseline
Affiliations
Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China
Nano Science and Technology Institute, University of Science and Technology of China, No. 166 Renai Road, Suzhou 215000, China
Guangdong Provincial Key Laboratory of New Metal Materials, South China University of Technology, Guangzhou 510641, China
Department of Electronics Engineering, The Chinese University of Hong Kong, Hong Kong 999077, China
Funding
National Key Research and Development Program of China · Basic and Applied Basic Research Foundation of Guangdong Province · National Natural Science Foundation of China · Shenzhen Science and Technology Innovation Program · National and Local Joint Engineering Laboratory of Advanced Electronic Packaging Materials