Processing the Interlayer and Optimizing the Active Layer by One-Step Dissolution Compensation in Organic Solar Cells

Optimized morphology of the active layer and electrode interface is critical for obtaining high-performance organic solar cells. However, achieving this typically involves a multifaceted, sequential process that renders outcomes unpredictable. Here, by exploiting the dissolution compensation, we propose a one-step method that integrates interlayer fabrication and a controllable morphology optimization. Taking an “out of the box” approach, we incorporate the good solvent of the active layer into the interlayer solution to act as dissolution compensation, breaking the orthogonal solvent principles to allow the morphology of the active layer to evolve to an optimized state while the interface layer is being processed. Using two commercially available material systems, D18:Y6 and D18:L8-BO, as examples, it was found that the J SC and fill factor (FF) device can be improved by using an appropriate ratio of the compensation solvent chloroform in the interlayer solution. As a result, the power conversion efficiency of the device based on the two state-of-the-art systems can be increased by about 7.5% (D18:Y6, from 17.04 to 18.31%; D18:L8-BO, from 17.97 to 19.31%). This one-step strategy has been shown to be universally applicable to other diverse systems and provides a simple yet reliable method for accurately depositing high-quality interlayers with an optimized active layer morphology in high-performance organic solar cells and other solution-processable organic electronics.