journal article·2021-11-24

Rational Design on Controllable Cation Injection with Improved Conductive-Bridge Random Access Memory by Glancing Angle Deposition Technology toward Neuromorphic Application

Yu-Chuan Shih, Ying-Chun Shen, Yen-Kai Cheng, Mayur Chaudhary, Tzu-Yi Yang, Yi-Jen Yu, Yu-Lun Chueh

ACS Applied Materials & Interfaces· Volume 13· Issue 46
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Abstract

A conductive-bridge random access memory (CBRAM) has been considered a promising candidate for the next-generation nonvolatile memory technology because of its excellent performance, for which the resistive switching behavior depends on the formation/dissolution of conducting filaments in an electrolyte layer originated by the cation injection from the active electrode with electrochemical reactions. Typically, the controllability of cations into the electrolyte layer is a main issue, leading to stable switching reliability. In this work, an architecture combining spike-shaped Ag electrodes created by Al2O3 nanopillar arrays as a physical diffusion barrier by glancing angle deposition technology was proposed to localize Ag cation injection for the formation of controllable filaments inside TiOx as the switching layer. Interestingly, the dimension of the Ag plugs defined by the topography of Al2O3 nanopillar arrays can control Ag cation injection to influence the dimensionality of conductive filaments. Compared to the typical planar-Ag/TiOx/Pt device, the spiked-Ag/Al2O3 nanopillar arrays/TiOx/Pt device shows improvement of endurance and voltage disturbance. With enhanced multilevel characteristics, the spiked active-metal-based CBRAM device can be expected to serve as an analogue synapse for neuromorphic applications.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Advanced Memory and Neural Computing · Ferroelectric and Negative Capacitance Devices · Neuroscience and Neural Engineering

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu 30013, Taiwan

Frontier Research Center on Fundamental and Applied Sciences of Matters, National Tsing Hua University, Hsinchu 30013, Taiwan

Department of Physics, National Sun Yat-Sen University, Kaohsiung 80424, Taiwan

Instrument Center, National Tsing Hua University, Hsinchu 30013, Taiwan

Funding

Ministry of Science and Technology

References (56)

Show source-provided references
1. 10.1038/nnano.2012.24010.1038/nnano.2012.240 ↗
2. 10.1002/adma.20090037510.1002/adma.200900375 ↗
3. 10.1002/adma.20110259710.1002/adma.201102597 ↗
4. 10.1557/mrs.2012.510.1557/mrs.2012.5 ↗
5. Zahurak, J.; Miyata, K.; Fischer, M.; Balakrishnan, M.; Chhajed, S.; Wells, D.; Li, H.; Torsi, A.; Lim, J.; Korber, M.; Nakazawa, K.; Mayuzumi, S.; Honda, M.; Sills, S.; Yasuda, S.; Calderoni, A.; Cook, B.; Damarla, G.; Tran, H.; Wang, B.; Cardon, C.; Karda, K.; Okuno, J.; Johnson, A.; Kunihiro, T.; Sumino, J.; Tsukamoto, M.; Aratani, K.; Ramaswamy, N.; Otsuka, W.; Prall, K. Process Integration of a 27nm,16Gb Cu ReRAM.IEEE International Electron Devices Meeting, 2014; pp 6.2.1–6.2.4.10.1109/IEDM.2014.7046994 ↗
6. Belmonte, A.; Radhakrishnan, J.; Goux, L.; Donadio, G. L.; Kumbhare, P.; Redolfi, A.; Delhougne, R.; Nyns, L.; Devulder, W.; Witters, T.; Covello, A.; Vereecke, G.; Franquet, A.; Spampinato, V.; Kundu, S.; Mao, M.; Hody, H.; Kar, G. S. Co Active Electrode Enhances CBRAM Performance and Scaling Potential.IEEE International Electron Devices Meeting, 2019; pp 35.8.1–35.8.4.10.1109/IEDM19573.2019.8993527 ↗
7. 10.1088/0957-4484/22/25/25400310.1088/0957-4484/22/25/254003 ↗
8. 10.1002/adma.20110410410.1002/adma.201104104 ↗
9. 10.1038/ncomms523210.1038/ncomms5232 ↗
10. 10.1002/adma.20150420210.1002/adma.201504202 ↗
11. 10.1038/ncomms278410.1038/ncomms2784 ↗
12. 10.1016/j.mee.2015.04.04410.1016/j.mee.2015.04.044 ↗
13. Park, S.G.; Yang, M. K.; Ju, H.; Seong, D.J.; Lee, J. M.; Kim, E.; Jung, S.; Zhang, L.; Shin, Y. C.; Baek, I.G.; Choi, J.; Kang, H.K.; Chung, C. A Non-Linear ReRAM Cell with Sub-1μA Ultralow Operating Current for High Density Vertical Resistive Memory (VRRAM).IEEE International Electron Devices Meeting, 2012; pp 20.8.1–20.8.4.10.1109/IEDM.2012.6479084 ↗
14. 10.1149/2.0221603jss10.1149/2.0221603jss ↗
15. 10.1039/c5nr08735j10.1039/c5nr08735j ↗
16. Celano, U.; Goux, L.; Belmonte, A.; Opsomer, K.; Detavernier, C.; Jurczak, M.; Vandervorst, W. Conductive Filaments Multiplicity as a Variability Factor in CBRAM.IEEE International Reliability Physics Symposium, 2015; pp MY.11.1–MY.11.3.10.1109/IRPS.2015.7112813 ↗
17. 10.1038/srep0776410.1038/srep07764 ↗
18. 10.1039/c6ra18668h10.1039/c6ra18668h ↗
19. 10.1063/1.488385610.1063/1.4883856 ↗
20. 10.1063/1.362183510.1063/1.3621835 ↗
21. Guy, J.; Molas, G.; Blaise, P.; Carabasse, C.; Bernard, M.; Roule, A.; Le Carval, G.; Sousa, V.; Grampeix, H.; Delaye, V.; Toffoli, A.; Cluzel, J.; Brianceau, P.; Pollet, O.; Balan, V.; Barraud, S.; Cueto, O.; Ghibaudo, G.; Clermidy, F.; De Salvo, B.; Perniola, L. Experimental and Theoretical Understanding of Forming, SET and RESET Operations in Conductive Bridge RAM (CBRAM) for Memory Stack Optimization.IEEE International Electron Devices Meeting, 2014; pp 6.5.1–6.5.4.10.1109/IEDM.2014.7046997 ↗
22. 10.1021/acscombsci.5b0002510.1021/acscombsci.5b00025 ↗
23. 10.1038/nmat475610.1038/nmat4756 ↗
24. 10.1002/adfm.20100152010.1002/adfm.201001520 ↗
25. 10.1002/adfm.20170201010.1002/adfm.201702010 ↗
26. Belmonte, A.; Kim, W.; Chan, B. T.; Heylen, N.; Fantini, A.; Houssa, M.; Jurczak, M.; Goux, L. 90nm W/Al2O3/TiW/Cu 1T1R CBRAM cell showing low-power, fast and disturb-free operation.IEEE International Memory Workshop (IMW), 2013; pp 26–29.10.1109/IMW.2013.6582089 ↗
27. 10.1109/led.2015.250717810.1109/led.2015.2507178 ↗
28. 10.1063/1.498346510.1063/1.4983465 ↗
29. 10.1002/smll.20160394810.1002/smll.201603948 ↗
30. Guy, J.; Molas, G.; Vianello, E.; Longnos, F.; Blanc, S.; Carabasse, C.; Bernard, M.; Nodin, J. F.; Toffoli, A.; Cluzel, J.; Blaise, P.; Dorion, P.; Cueto, O.; Grampeix, H.; Souchier, E.; Cabout, T.; Brianceau, P.; Balan, V.; Roule, A.; Maitrejean, S.; Perniola, L.; De Salvo, B. Investigation of the physical mechanisms governing data-retention in down to 10nm Nano-trench Al2O3/CuTeGe Conductive Bridge RAM (CBRAM).IEEE International Electron Devices Meeting, 2013; pp 30.2.1–30.2.4.10.1109/IEDM.2013.6724722 ↗
31. Sills, S.; Yasuda, S.; Strand, J.; Calderoni, A.; Aratani, K.; Johnson, A.; Ramaswamy, N. A Copper ReRAM Cell for Storage Class Memory Applications.Symposium on VLSI Technology: Digest of Technical Papers, 2014; pp 1–2.10.1109/VLSIT.2014.6894368 ↗
32. Yasuda, S.; Ohba, K.; Mizuguchi, T.; Sei, H.; Shimuta, M.; Aratani, K.; Shiimoto, T.; Yamamoto, T.; Sone, T.; Nonoguchi, S.; Okuno, J.; Kouchiyama, A.; Otsuka, W.; Tsutsui, K. A Cross Point Cu-ReRAM with a Novel OTS Selector for Storage Class Memory Applications.Symposium on VLSI Technology, 2017; pp T30–T31.10.23919/VLSIT.2017.7998189 ↗
33. Kund, M.; Beitel, G.; Pinnow, C.U.; Röhr, T.; Schumann, J.; Symanczyk, R.; Ufert, K.; Müller, G. Conductive Bridging RAM (CBRAM): An Emerging Non-volatile Memory Technology Scalable to Sub 20nm.IEEE International Electron Devices Meeting, 2005; pp 754–757.10.1109/IEDM.2005.1609463 ↗
34. 10.1109/led.2017.277171810.1109/led.2017.2771718 ↗
35. 10.1002/aelm.20160023310.1002/aelm.201600233 ↗
36. 10.1021/acsami.7b1018810.1021/acsami.7b10188 ↗
37. 10.1002/adfm.20180627810.1002/adfm.201806278 ↗
38. 10.1088/0957-4484/18/14/14550410.1088/0957-4484/18/14/145504 ↗
39. 10.1021/ph500091h10.1021/ph500091h ↗
40. 10.1109/ted.2017.274178210.1109/ted.2017.2741782 ↗
41. 10.1109/ted.2011.216751310.1109/ted.2011.2167513 ↗
42. Lide D. R. · 2003
43. 10.1002/adma.20160269710.1002/adma.201602697 ↗
44. 10.1002/adfm.20190504010.1002/adfm.201905040 ↗
45. 10.1039/c9ta01960j10.1039/c9ta01960j ↗
46. 10.1109/led.2011.215799010.1109/led.2011.2157990 ↗
47. 10.1021/acsnano.7b0078310.1021/acsnano.7b00783 ↗
48. 10.1109/ted.2018.287978810.1109/ted.2018.2879788 ↗
49. 10.1038/s41467-018-07979-010.1038/s41467-018-07979-0 ↗
50. 10.1109/led.2015.250717810.1109/led.2015.2507178 ↗
51. 10.1063/1.494175210.1063/1.4941752 ↗
52. 10.1063/1.496213610.1063/1.4962136 ↗
53. Hamann C. H. · 2007
54. 10.1109/ted.2018.285749410.1109/ted.2018.2857494 ↗
55. 10.1109/led.2016.258285910.1109/led.2016.2582859 ↗
56. 10.1109/led.2018.278942510.1109/led.2018.2789425 ↗