Spatial Site-Patterning of Wettability in a Microcapillary Tube
Source abstract
Abstract
Substrate functionalization is of great importance in successfully manipulating flows and liquid interfaces in microdevices. Herein, we propose an alternative approach for spatial patterning of wettability in a microcapillary tube. The method combines a photolithography process with self-assembled monolayer formation. The modified microcapillaries show very sharp boundaries between the alternating hydrophilic/hydrophobic segments with an achieved smallest domain dimension down to 60 μm inside a 580 μm inner diameter capillary. Our two-step method allows us to pattern multiple types of functional groups in an enclosed channel. Such structures are promising regarding the manipulation of segmented flows inside capillaries.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Surface Modification and Superhydrophobicity · Innovative Microfluidic and Catalytic Techniques Innovation · Electrowetting and Microfluidic Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Soft Matter, Fluidics and Interfaces, MESA+ Institute for Nanotechnology, Faculty of Science and Technology, University of Twente, Enschede, The Netherlands
Mechanical Engineering, University of Science and Technology Beijing, Beijing, China
Department of Mechanical Engineering, University of Alberta, Edmonton, Alberta, Canada
Funding
Technologiestichting STW
References (29)
Show source-provided references
1. 10.1039/B813724B10.1039/B813724B ↗
2. 10.1038/nature0416310.1038/nature04163 ↗
3. 10.1016/S0924-4247(03)00363-710.1016/S0924-4247(03)00363-7 ↗
4. 10.1088/0960-1317/16/5/R0110.1088/0960-1317/16/5/R01 ↗
5. 10.1021/ac049844h10.1021/ac049844h ↗
6. 10.1039/b822106e10.1039/b822106e ↗
7. 10.3390/molecules1607604110.3390/molecules16076041 ↗
8. 10.1007/s00216-007-1496-410.1007/s00216-007-1496-4 ↗
9. 10.1021/ja00076a03810.1021/ja00076a038 ↗
10. 10.1002/adma.20050196110.1002/adma.200501961 ↗
11. 10.1021/nl049873810.1021/nl0498738 ↗
12. 10.1088/0960-1317/14/4/00910.1088/0960-1317/14/4/009 ↗
13. 10.1063/1.349364310.1063/1.3493643 ↗
14. 10.1021/ja804803s10.1021/ja804803s ↗
15. 10.1021/ac060304p10.1021/ac060304p ↗
16. 10.1021/la901558n10.1021/la901558n ↗
17. 10.1016/j.jcis.2013.03.05810.1016/j.jcis.2013.03.058 ↗
18. 10.1039/b618851f10.1039/b618851f ↗
19. 10.1021/am508120s10.1021/am508120s ↗
20. 10.1039/c0lc00438c10.1039/c0lc00438c ↗
21. 10.1126/science.291.5506.102310.1126/science.291.5506.1023 ↗
22. Levinson H. J. · 200510.1117/3.601520 ↗
23. Glendinning W. B. · 2012
24. Brewer, T.; Flaim, T. D.; Moss, M. G.Adhesion Promoting Product and Process for Treating an Integrated Circuit Substrate. US Patent US 4 732 858, 1988.
25. 10.1109/T-ED.1975.1815910.1109/T-ED.1975.18159 ↗
26. 10.1016/S1369-7021(08)70053-110.1016/S1369-7021(08)70053-1 ↗
27. 10.1111/j.1365-2621.1977.tb01522.x10.1111/j.1365-2621.1977.tb01522.x ↗
28. 10.1007/s11483-007-9043-610.1007/s11483-007-9043-6 ↗
29. 10.1063/1.482345610.1063/1.4823456 ↗