journal article·2018-05-23

Microbubble-Triggered Spontaneous Separation of Transparent Thin Films from Substrates Using Evaporable Core–Shell Nanocapsules

Intae Son, Byungsun Lee, Jae Hong Kim, Chunho Kim, Ji Yong Yoo, Byung Wook Ahn, Jeongho Hwang, Jonghyuk Lee, Jun Hyup Lee

ACS Applied Materials & Interfaces· Volume 10· Issue 20
Publisher page

Abstract

The spontaneous separation of a polymer thin film from a substrate is an innovative technology that will enable material recycling and reduce manufacturing cost in the film industry, and this can be applied in a wide range of applications, from optical films to wearable devices. Here, we present an unprecedented spontaneous strategy for separating transparent polymer films from substrates on the basis of microbubble generation using nanocapsules containing an evaporable material. The core-shell nanocapsules are prepared from poly(methyl methacrylate)-polyethyleneimine nanoparticles via the encapsulation of methylcyclohexane (MCH). A spherical nanostructure with a vaporizable core is obtained, with the heat-triggered gas release ability leading to the formation of microbubbles. Our separation method applied to transparent polymer films doped with a small amount of the nanocapsules encapsulating evaporable MCH enables spontaneous detachment of thin films from substrates via vacuum-assisted rapid vaporization of MCH over a short separation time, and clear detachment of the film is achieved with no deterioration of the inherent optical transparency and adhesive property compared to a pristine film.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Nanomaterials and Printing Technologies · Innovative Microfluidic and Catalytic Techniques Innovation · Pickering emulsions and particle stabilization

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Chemical Engineering, Myongji University, Yongin, Gyeonggi-do 17058, Republic of Korea

Next Generation R&D Team, Samsung Display, Yongin, Gyeonggi-do 17113, Republic of Korea

Funding

Samsung

References (52)

Show source-provided references
1. 10.1038/ncomms283210.1038/ncomms2832 ↗
2. 10.1002/adma.20100409910.1002/adma.201004099 ↗
3. 10.1002/adma.20110106610.1002/adma.201101066 ↗
4. 10.1038/nmat289610.1038/nmat2896 ↗
5. 10.1038/nnano.2010.13210.1038/nnano.2010.132 ↗
6. 10.1038/srep1683810.1038/srep16838 ↗
7. 10.1021/nn405887k10.1021/nn405887k ↗
8. 10.1038/nphoton.2011.25910.1038/nphoton.2011.259 ↗
9. 10.1038/ncomms413210.1038/ncomms4132 ↗
10. 10.1038/ncomms400210.1038/ncomms4002 ↗
11. 10.1002/adfm.20130387410.1002/adfm.201303874 ↗
12. 10.1063/1.12081610.1063/1.120816 ↗
13. 10.1063/1.9192510.1063/1.91925 ↗
14. 10.1016/j.jcrysgro.2006.10.22410.1016/j.jcrysgro.2006.10.224 ↗
15. 10.1063/1.133851910.1063/1.1338519 ↗
16. 10.1143/jjap.38.l21710.1143/jjap.38.l217 ↗
17. 10.1016/j.solmat.2013.12.01310.1016/j.solmat.2013.12.013 ↗
18. 10.1002/1521-396x(200212)194:2<554::aid-pssa554>3.0.co;2-b10.1002/1521-396x(200212)194:2<554::aid-pssa554>3.0.co;2-b ↗
19. Kim, J. G.; Seok, S.; Rolland, N.; Rolland, P. A. A Novel Wafer Level Bonding/Debonding Technique Using an Anti-Adhesion Layer for Polymer-Based Zero-Level Packaging of RF Device. The 60th Electronic Components and Technology Conference; IEEE, 2010; pp 323–328.10.1109/ECTC.2010.5490954 ↗
20. Pargfrieder, S.; Kettner, P.; Privett, M.; Ting, J. Temporary Bonding and Debonding Enabling TSV Formation and 3D Integration for Ultra-thin Wafers. The 10th Electronics Packaging Technology Conference; IEEE, 2008; pp 1301–1305.10.1109/EPTC.2008.4763610 ↗
21. 10.1016/s0013-7944(98)00052-610.1016/s0013-7944(98)00052-6 ↗
22. Kawate, K.; Kanki, T. Heat Debondable Adhesive Composition and Adhesion Structure. EP 1141104 B1, 1999.
23. 10.1080/00218464.2016.122616910.1080/00218464.2016.1226169 ↗
24. 10.1007/s10973-013-3233-x10.1007/s10973-013-3233-x ↗
25. 10.1021/nn204524610.1021/nn2045246 ↗
26. 10.1038/nmat177510.1038/nmat1775 ↗
27. 10.1038/srep1078510.1038/srep10785 ↗
28. 10.1016/j.biomaterials.2010.08.03910.1016/j.biomaterials.2010.08.039 ↗
29. 10.1016/j.colsurfb.2010.12.01310.1016/j.colsurfb.2010.12.013 ↗
30. 10.1088/0957-4484/18/6/06570910.1088/0957-4484/18/6/065709 ↗
31. 10.1002/anie.20045372810.1002/anie.200453728 ↗
32. 10.1021/am404108n10.1021/am404108n ↗
33. 10.1039/c2cc38211c10.1039/c2cc38211c ↗
34. 10.1021/bm049234r10.1021/bm049234r ↗
35. 10.1007/s11095-013-1084-610.1007/s11095-013-1084-6 ↗
36. 10.1016/j.biomaterials.2007.11.01410.1016/j.biomaterials.2007.11.014 ↗
37. 10.4172/1948-593x.1000e11710.4172/1948-593x.1000e117 ↗
38. 10.1021/nn201171r10.1021/nn201171r ↗
39. 10.1038/nnano.2011.4210.1038/nnano.2011.42 ↗
40. 10.1021/ja111130t10.1021/ja111130t ↗
41. 10.1021/ja306501x10.1021/ja306501x ↗
42. 10.1016/j.elecom.2012.07.02710.1016/j.elecom.2012.07.027 ↗
43. 10.1016/j.apcatb.2015.05.03610.1016/j.apcatb.2015.05.036 ↗
44. 10.1166/jnn.2016.1325610.1166/jnn.2016.13256 ↗
45. Bellamy, L. J. The Infrared Spectra of Complex Molecules; John Wiley and Sons: New York, 1961; pp 43–48.
46. 10.1021/la026134310.1021/la0261343 ↗
47. 10.1002/polb.1989.09027050810.1002/polb.1989.090270508 ↗
48. 10.1016/s0920-5861(00)00564-210.1016/s0920-5861(00)00564-2 ↗
49. 10.1016/j.jaap.2010.08.00310.1016/j.jaap.2010.08.003 ↗
50. 10.1016/j.tca.2006.11.00210.1016/j.tca.2006.11.002 ↗
51. 10.1016/s0040-6090(00)01369-910.1016/s0040-6090(00)01369-9 ↗
52. 10.1016/s0266-3538(02)00059-310.1016/s0266-3538(02)00059-3 ↗