DataVXACS Applied Materials & InterfacesPaper
journal article·2023-04-26

Stretchable Ink Printed Graphene Device with Weft-Knitted Fabric Substrate Based on Thermal-Acoustic Effect

He Tian, Wen Gu, Xiao-Shi Li, Tian-Ling Ren

ACS Applied Materials & Interfaces· Volume 15· Issue 16
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Source abstract

Abstract

Thermal-acoustic devices have great potential as flexible ultrathin sound sources. However, stretchable sound sources based on a thermal-acoustic mechanism remain elusive, as realizing stable resistance in a reasonable range is challenging. In this study, a stretchable thermal-acoustic device based on graphene ink is fabricated on a weft-knitted fabric. After optimization of the graphene ink concentration, the device resistance changes by 8.94% during 4000 cycles of operation in the unstretchable state. After multiple cycles of bending, folding, prodding, and washing, the sound pressure level (SPL) change of the device is within 10%. Moreover, the SPL has an increase with the strain in a specific range, showing a phenomenon similar to the negative differential resistance (NDR) effect. This study sheds light on the use of stretchable thermal-acoustic devices for e-skin and wearable electronics.
Source: openalex_inverted_index · Quality: baseline

Research context

Nanomaterials

OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · Tactile and Sensory Interactions · Nanomaterials and Printing Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

School of Integrated Circuits, Tsinghua University, Beijing 100084, China

Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua University, Beijing 100084, China

Funding

Xi?an Jiaotong University · Ministry of Science and Technology of the People's Republic of China · Toyota Motor Corporation · Natural Science Foundation of Beijing Municipality · Fok Ying Tung Education Foundation · Beijing Innovation Center for Future Chip · Beijing National Research Center For Information Science And Technology · Tencent · Tsinghua University · National Natural Science Foundation of China · Tsinghua-Foshan Innovation Special Fund · Center for Flexible Electronics Technology, Tsinghua University · Guoqiang Institute, Tsinghua University · Key Laboratory of Microelectronic Devices and Integrated Technology Institute of Microelectronics, Chinese Academy of Sciences · Daikin Industries, Ltd · State Key Laboratory of New Ceramic and Fine Processing, Tsinghua University

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