High Breakdown Current Density in Quasi-1D van der Waals Layered Material Ta2NiSe7
Source abstract
Abstract
We synthesized ternary composition chalcogenide Ta2NiSe7, a quasi-one-dimensional (Q1D) material with excellent crystallinity. To utilize the excellent electrical conductivity property of Ta2NiSe7, the breakdown current density (JBD) according to thickness change through mechanical exfoliation was measured. It was confirmed that as the thickness decreased, the maximum breakdown voltage (VBD) increased, and at 18 nm thickness, 35 MA cm–2 of JBD was measured, which was 35 times higher than that of copper, which is commonly used as an interconnect material. By optimization of the exfoliation process, it is expected that through a theoretical model fitting, the JBD can be increased to about 356 MA cm–2. It is expected that the low-dimensional materials with ternary compositions proposed through this experiment can be used as candidates for current-carrying materials that are required for the miniaturization of various electronic devices.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: 2D Materials and Applications · MXene and MAX Phase Materials · Graphene research and applications
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
School of Advanced Materials Science & Engineering, Sungkyunkwan University, Suwon 16419, Republic of Korea
SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, Suwon 16419, Republic of Korea
Department of Materials Science and Engineering & Department of Energy Systems Research, Ajou University, Suwon 16499, Republic of Korea
Funding
National Research Foundation of Korea
References (57)
Show source-provided references
1. 10.1021/nl300584r10.1021/nl300584r ↗
2. 10.1109/LED.2011.210825910.1109/LED.2011.2108259 ↗
3. 10.1063/1.314718310.1063/1.3147183 ↗
4. 10.1126/science.119497510.1126/science.1194975 ↗
5. 10.1088/1361-6528/aaeb7010.1088/1361-6528/aaeb70 ↗
6. 10.1038/nnano.2014.3510.1038/nnano.2014.35 ↗
7. 10.1073/pnas.141658111210.1073/pnas.1416581112 ↗
8. 10.1039/C4CS00182F10.1039/C4CS00182F ↗
9. 10.1021/nn202455710.1021/nn2024557 ↗
10. 10.1007/s11434-015-0936-310.1007/s11434-015-0936-3 ↗
11. 10.1126/science.122641910.1126/science.1226419 ↗
12. 10.1039/C8RA07437B10.1039/C8RA07437B ↗
13. 10.1002/chem.20140642810.1002/chem.201406428 ↗
14. 10.1002/pssr.20180045110.1002/pssr.201800451 ↗
15. 10.3390/nano810079410.3390/nano8100794 ↗
16. 10.1039/C8RA06398B10.1039/C8RA06398B ↗
17. 10.1021/acsabm.0c0054110.1021/acsabm.0c00541 ↗
18. 10.1021/ic034634t10.1021/ic034634t ↗
19. 10.1021/acsomega.0c0038810.1021/acsomega.0c00388 ↗
20. 10.1002/advs.20150028710.1002/advs.201500287 ↗
21. 10.1002/adfm.20200263410.1002/adfm.202002634 ↗
22. 10.1016/j.jallcom.2020.15737510.1016/j.jallcom.2020.157375 ↗
23. Moore G. E. · 1965
24. Wilson, L. International Technology Roadmap for Semiconductors (ITRS); Semiconductor Industry Association, 2013.
25. 10.1021/acs.nanolett.9b0095810.1021/acs.nanolett.9b00958 ↗
26. 10.1039/C6NR03469A10.1039/C6NR03469A ↗
27. 10.1002/advs.20180137010.1002/advs.201801370 ↗
28. 10.1021/acsnano.6b0236810.1021/acsnano.6b02368 ↗
29. 10.1016/j.jallcom.2021.15905410.1016/j.jallcom.2021.159054 ↗
30. 10.1039/D0TC03936E10.1039/D0TC03936E ↗
31. 10.1126/science.115887710.1126/science.1158877 ↗
32. 10.1088/2053-1583/aa592110.1088/2053-1583/aa5921 ↗
33. 10.1021/acsaelm.0c0078810.1021/acsaelm.0c00788 ↗
34. 10.3390/ma1215246210.3390/ma12152462 ↗
35. 10.1088/2053-1583/ab57ef10.1088/2053-1583/ab57ef ↗
36. 10.1016/j.scib.2020.05.00810.1016/j.scib.2020.05.008 ↗
37. 10.1063/1.320497110.1063/1.3204971 ↗
38. 10.1063/1.367106910.1063/1.3671069 ↗
39. 10.1002/smll.20160120710.1002/smll.201601207 ↗
40. 10.1063/1.291883910.1063/1.2918839 ↗
41. Steinhoegl, W.; Schindler, G.; Steinlesberger, G.; Traving, M.; Engelhardt, M. Scaling Laws for the Resistivity Increase of Sub-100 nm Interconnects. In Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices, 2003. SISPAD 2003, Sept 3–5, 2003; IEEE, 2003; pp 27–30.10.1109/SISPAD.2003.1233629 ↗
42. Huang, Q.; Lilley, C. M.; Bode, M.; Divan, R. S. Electrical Properties of Cu Nanowires. In Proceedings of the 2008 8th IEEE Conference on Nanotechnology, Aug 18–21, 2008, IEEE, 2008; pp 549–552.10.1109/NANO.2008.163 ↗
43. 10.1016/0040-6090(77)90455-210.1016/0040-6090(77)90455-2 ↗
44. 10.1109/TDMR.2005.84682610.1109/TDMR.2005.846826 ↗
45. 10.1016/j.jpcs.2007.07.11910.1016/j.jpcs.2007.07.119 ↗
46. 10.1149/1.181273410.1149/1.1812734 ↗
47. 10.1021/jp200426s10.1021/jp200426s ↗
48. 10.1002/adfm.20160564710.1002/adfm.201605647 ↗
49. 10.1016/j.apsusc.2021.14917710.1016/j.apsusc.2021.149177 ↗
50. 10.1021/acs.nanolett.6b0448710.1021/acs.nanolett.6b04487 ↗
51. 10.1063/1.502357710.1063/1.5023577 ↗
52. 10.1016/j.matchemphys.2019.12195810.1016/j.matchemphys.2019.121958 ↗
53. 10.1016/j.nanoen.2016.08.06510.1016/j.nanoen.2016.08.065 ↗
54. 10.1002/adom.20180005810.1002/adom.201800058 ↗
55. 10.1002/adma.20180630610.1002/adma.201806306 ↗
56. 10.1002/adfm.20160380410.1002/adfm.201603804 ↗
57. 10.1021/acsnano.7b0486010.1021/acsnano.7b04860 ↗